LEAD FRAME FOR SEMICONDUCTOR

PROBLEM TO BE SOLVED: To provide a lead frame easy to remove its oxide by electrolytic reduction, rigid not to much with interlayers made of materials whose corrosion resistances are equal to or smaller than its substrate material. SOLUTION: This lead frame 1 is constituted to have a chip mounting p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOSHIOKA OSAMU, AKINO HISANORI, TOMOBE MASAKATSU, OZAKI TOSHINORI, TAKEYA NORIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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