METHOD FOR SOLDER BONDING OF ARRAY OF CONTACT PAD AND ITS COMPONENT ASSEMBLY

PROBLEM TO BE SOLVED: To connect contact arrays on substrates which have different coefficients of thermal expansion by making a part covered with a solder bump in contact structure have smaller mean sectional area in a plane parallel to an array than the corresponding mean sectional area of each so...

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Hauptverfasser:	DAHRINGER DONALD WILLIAM, D ASARO LUCIAN ARTHUR, TSENG BETTY JYUE, LEO MARIA FREISHYN, HUI SANGHEE PARK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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