SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To apply a pressure uniformly onto a tape with a tool to uniformly bring the tape into close contact with a chip so as to keep the chip free from a bonding failure and high in reliability by a method wherein plating is performed corresponding to all the area of a lead where the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YAMAGATA OSATAKE, ITO SEIGO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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