SOLDER PARTICLE, SOLDER PASTE, MANUFACTURE OF SOLDER PARTICLE AND METHOD OF MOUNTING DEVICE ON CIRCUIT BOARD

PROBLEM TO BE SOLVED: To prevent occurrence of defect in wire bonding by forming solder particles flat in shape so that no particles are rolled easily with the wind or the like, and generating a state where the surfaces of the particles are in contact with each other so that no particles are blown a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SATO KAZUNORI, UNO YUJI, YASUHARA TAKAFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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