METHOD OF CLEANING WAFER, UTILIZING CHEMICAL AND PHYSICAL TREATMENTS AT ONCE

PROBLEM TO BE SOLVED: To effectively remove contaminants remaining on a wafer after the CMP process by applying a chemical soln. during the scrubbing step using brushes. SOLUTION: The method comprises step 10 of feeding a deionized water and first chemical soln. from a brush station having wafer cle...

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Hauptverfasser:	SONG CHANG-YONG, KIN SEITOKU, KO YOSEN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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