RESIN MOLDING APPARATUS
PROBLEM TO BE SOLVED: To provide a resin molding apparatus having simple constitution and almost not molding or generating a non-molded product part. SOLUTION: This resin molding apparatus is constituted of a freely up and down movable upper mold 5 having a shape of a molded product formed to the si...
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| creator | NAKAJIMA MASAHIRO TONO HIROAKI KITAGAWA TOMOKAZU |
| description | PROBLEM TO BE SOLVED: To provide a resin molding apparatus having simple constitution and almost not molding or generating a non-molded product part. SOLUTION: This resin molding apparatus is constituted of a freely up and down movable upper mold 5 having a shape of a molded product formed to the single surface thereof and provided with a part of one or a plurality of cavity parts, the lower mold 6 opposed to the upper mold and having the residual part constituting the cavity part 1 provided to the single surface thereof and having the small diameter 9 through the conical taper part 10 continuing to the large diameter part 3 becoming a charging part of a tablet-shaped molding resin 2 provided thereto so as to be connected to the bottom surface of the cavity part 1 and an up and down freely movable plunger 4 corresponding to and coinciding with the large diameter part 3 and pressing the molding resin 2. |
| format | Patent |
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SOLUTION: This resin molding apparatus is constituted of a freely up and down movable upper mold 5 having a shape of a molded product formed to the single surface thereof and provided with a part of one or a plurality of cavity parts, the lower mold 6 opposed to the upper mold and having the residual part constituting the cavity part 1 provided to the single surface thereof and having the small diameter 9 through the conical taper part 10 continuing to the large diameter part 3 becoming a charging part of a tablet-shaped molding resin 2 provided thereto so as to be connected to the bottom surface of the cavity part 1 and an up and down freely movable plunger 4 corresponding to and coinciding with the large diameter part 3 and pressing the molding resin 2.</description><edition>6</edition><language>eng</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980929&DB=EPODOC&CC=JP&NR=H10258441A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980929&DB=EPODOC&CC=JP&NR=H10258441A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKAJIMA MASAHIRO</creatorcontrib><creatorcontrib>TONO HIROAKI</creatorcontrib><creatorcontrib>KITAGAWA TOMOKAZU</creatorcontrib><title>RESIN MOLDING APPARATUS</title><description>PROBLEM TO BE SOLVED: To provide a resin molding apparatus having simple constitution and almost not molding or generating a non-molded product part. 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SOLUTION: This resin molding apparatus is constituted of a freely up and down movable upper mold 5 having a shape of a molded product formed to the single surface thereof and provided with a part of one or a plurality of cavity parts, the lower mold 6 opposed to the upper mold and having the residual part constituting the cavity part 1 provided to the single surface thereof and having the small diameter 9 through the conical taper part 10 continuing to the large diameter part 3 becoming a charging part of a tablet-shaped molding resin 2 provided thereto so as to be connected to the bottom surface of the cavity part 1 and an up and down freely movable plunger 4 corresponding to and coinciding with the large diameter part 3 and pressing the molding resin 2.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | RESIN MOLDING APPARATUS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T15%3A03%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAKAJIMA%20MASAHIRO&rft.date=1998-09-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH10258441A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |