CERAMIC MULTILAYER CIRCUIT BOARD

PROBLEM TO BE SOLVED: To respond to required characteristic of adhesive properties or conducting resistance with a board by forming at least outer conductor layer of W as a forming material, and forming at least one of inner conductor layers of Mo as a forming material. SOLUTION: Outer conductor layers 11a, 11b and inner layer conductor 12 are formed on both the main surfaces of a board 14. Inner conductor layers are similarly formed in a vertical direction, and a via 13 for connecting inner layer conductors 12 to each other or the layers 11a, 11b to the conductor 12 is formed. The layers 11a, 11b are formed of W or an alloy containing W as a main component, and the conductor 12 and via 13 are formed of Mo or an alloy containing Mo as a main component. Accordingly, the outer conductor layer has superior adhesive strength with the board, and the inner conductor layer has small resistivity. In the case of using a high-frequency signal, transmission loss can be reduced.