MANUFACTURE OF MULTILAYER PRINTED BOARD

PROBLEM TO BE SOLVED: To improve the solder heat resistance and productivity in the process of manufacturing a multilayer printed board, using prepreg sheets which easily absorb moisture esp., in manufacturing steps among circuit boards used for various electronic apparatuses by setting the moisture...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MITAMURA SADAO, TAKENAKA TOSHIAKI, NAKAMURA SHINJI, NAKAYA YASUHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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