MANUFACTURE OF CIRCUIT ELECTRODE PORTION AND CIRCUIT ELECTRODE PORTION

MANUFACTURE OF CIRCUIT ELECTRODE PORTION AND CIRCUIT ELECTRODE PORTION

PROBLEM TO BE SOLVED: To reduce spots and discolorations appearing on the surface of the gold film of a circuit electrode portion or the generations of the cracks of its pad portion and to form the circuit electrode portion with a good bonding ability by suppressing the erosions of its nickel film,...

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Hauptverfasser: TSUCHIYA JOJI, YAZAWA AKIRA, MINATO MAYUMI
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator TSUCHIYA JOJI
YAZAWA AKIRA
MINATO MAYUMI
description PROBLEM TO BE SOLVED: To reduce spots and discolorations appearing on the surface of the gold film of a circuit electrode portion or the generations of the cracks of its pad portion and to form the circuit electrode portion with a good bonding ability by suppressing the erosions of its nickel film, when performing its electroless gold plating of a substitution type. SOLUTION: On the surface of a pad base portion 2, formed by a copper plating, a palladium film 3 is formed by an electroless plating to form thereon a nickel film 4 containing phosphorus by an electroless plating. On the surface of the nickel film 4, a gold film 5 is formed by a substitution type electroless plating. Since the phosphorus concentration of the nickel film 4 is lowers as it is nearer the palladium film 3 to its upper layer, the erosions of the nickel film 4 when forming the gold film 5 are suppressed.
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SOLUTION: On the surface of a pad base portion 2, formed by a copper plating, a palladium film 3 is formed by an electroless plating to form thereon a nickel film 4 containing phosphorus by an electroless plating. On the surface of the nickel film 4, a gold film 5 is formed by a substitution type electroless plating. 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SOLUTION: On the surface of a pad base portion 2, formed by a copper plating, a palladium film 3 is formed by an electroless plating to form thereon a nickel film 4 containing phosphorus by an electroless plating. On the surface of the nickel film 4, a gold film 5 is formed by a substitution type electroless plating. 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SOLUTION: On the surface of a pad base portion 2, formed by a copper plating, a palladium film 3 is formed by an electroless plating to form thereon a nickel film 4 containing phosphorus by an electroless plating. On the surface of the nickel film 4, a gold film 5 is formed by a substitution type electroless plating. Since the phosphorus concentration of the nickel film 4 is lowers as it is nearer the palladium film 3 to its upper layer, the erosions of the nickel film 4 when forming the gold film 5 are suppressed.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title MANUFACTURE OF CIRCUIT ELECTRODE PORTION AND CIRCUIT ELECTRODE PORTION
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