MANUFACTURE OF MULTILAYER PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a manufacturing method excellent in production efficiency of a multilayer printed wiring board equipped with electronic parts housing hole, to form an outer layer circuit in condition that the inside of the electronic parts housing hole is protected. SOLUTION: This manufacture has next each process: (1); a process of forming a stack (10) which has an electronic part housing hole 2, (2); a process of introducing an iron core 7 into the electronic parts housing hole 2, (3); a process of bonding a copper foil 6 on the surface of the stack 10 through the adhesive layer 4 having an opening 16 and forming a multilayer plate 11 covered with a copper foil 6, (4); a process of forming an outer layer circuit 10 on the surface of the multilayer board 11 and also, processing the copper foil 6 covering the electronic parts housing hole 2 into such form that it covers the electronic parts housing hole 2, being separated from outer layer circuit 9, and (5); a process of separating and removing the iron core 7, together with the copper foil 6 covering the electronic parts housing hole 2, and opening an electronic parts housing hole 2, using a magnetic force generator.