HEAT PIPE-TYPE HEAT SINK FOR COOLING SEMICONDUCTOR ELEMENT

PROBLEM TO BE SOLVED: To reduce parts and the amount of solder and to prevent the occurrence of ununiform heat in a heat transfer block by fixing a gap between heat pipes and the heat transfer block by means of solder and fitting heat radiation fins to a linear part toward the direction of this side...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	OGAWARA HIROYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
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