HEAT PIPE-TYPE HEAT SINK FOR COOLING SEMICONDUCTOR ELEMENT

PROBLEM TO BE SOLVED: To reduce parts and the amount of solder and to prevent the occurrence of ununiform heat in a heat transfer block by fixing a gap between heat pipes and the heat transfer block by means of solder and fitting heat radiation fins to a linear part toward the direction of this side of the heat transfer block or an inner direction in the heat radiation part of the heat pipes. SOLUTION: The heat pipes 2 on the lower stage-side of the heat transfer block 1 are vertically arranged. When a heat sink operates, the travel wind of a train is hit from a lateral direction and all the heat pipes 2 can efficiently be cooled. The heat pipes 2 rise from right and left faces on the lower stage-side of the heat transfer block 1, the interval between the right and left heat pipes 2 is wide, and the right and left heat radiation fins 3 are separated. Thus, not all heat radiated from the heat radiation fin 3 on the side of windward is directly transmitted to the heat radiation fin 3 on the side of lee but it is radiated midway into air. Consequently, the heat radiation efficiency of the heat sink improves and the ununiform heat of the heat transfer block can be eliminated.