DISCHARGING METHOD OF RESIN SEALED SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To effectively discharge the static electricity in the manufacturing steps by a method wherein a semiconductor device sealed with a mold resin having the characteristic of volume resistivity inversely proportional to the temperature is heat-treated. SOLUTION: The volume resisti...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	WAKITA YUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!