DISCHARGING METHOD OF RESIN SEALED SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To effectively discharge the static electricity in the manufacturing steps by a method wherein a semiconductor device sealed with a mold resin having the characteristic of volume resistivity inversely proportional to the temperature is heat-treated. SOLUTION: The volume resistitivty of a mold resin 4 comprising the package contour e.g. an epoxy resin is reduced by the temperature fluctuation by heat-treating the whole semiconductor 1. Accordingly, the transferred charge per unit time is increased for accelerating the transfer rate of the charge. Thus, the charge accumulated in the semiconductor 1 is externally transferred along the surface of the mold resin 4 through the intermediary of a low potential parts e.g. so-called outerleads externally protruded. Furthermore, in addition to the charge transfer, the water content in the resin 4 by the moisture absorption of the mold resin 4 is evaporated by the heat treatment. Through these procedures, the charge accumulated in the semiconductor 1 is discharged into the air together with the steam.