POWER SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To provide a power semiconductor module of a combination of a power transistor and a free wheeling diode, which can improve a heat radiating performance by suppressing thermal interference between a transistor chip and a diode chip. SOLUTION: A set of chip elements of a power transistor 6 and a free wheeling diode 7 is mounted on an insulating substrate 5 to form a power circuit assembly. In the assembly, the transistor and diode chips are mounted on respective conductor patterns separatedly formed on the insulating substrate. More specifically, the transistor chip is solder-mounted on a collector conductor pattern 8. The diode chip is subjected at a major broader area of its anode electrode leading side with a solder mountable processing process, solder-mounted on an emitter conductor pattern 9 with the anode electrode directed toward the insulating substrate, and its cathode electrode and the collector conductor pattern are interconnected by means of a connecting conductor piece 12.