CHEMICAL COPPER PLATING APPARATUS
PROBLEM TO BE SOLVED: To provide a chemical copper plating apparatus capable of decreasing the man-hours for plating work and shortening the staying time of printed circuit boards by making it possible to plate many kinds of the printed circuit boards with varying plating film thickness and making i...
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| creator | MATAHIRA HIROSHI TAKAI EIJI SASADA MASATO OGAWARA TOSHIYUKI NONAKA TAKAHIDE |
| description | PROBLEM TO BE SOLVED: To provide a chemical copper plating apparatus capable of decreasing the man-hours for plating work and shortening the staying time of printed circuit boards by making it possible to plate many kinds of the printed circuit boards with varying plating film thickness and making it possible to automate the analysis of a plating liquid, rack transportation, baking treatment after plating and rack release and history management. SOLUTION: This apparatus has a transportation control section for the plating apparatus for discretely controlling the racks to be charged into the plating 1 by one piece each and the plating cell 1 for making the concn. of the plating liquid in the plating cell uniform. Further, the apparatus has an automatic analysis adjustment control section having an automatic analyzer 15 which automatically analyzes the concn. of the plating liquid, predicts the change in the plating concn. after the charging from the number of the racks to be charged or the plating area simultaneously when the racks are charged from a rack transporting conveyor 8 and automatically controls the plating liquid in such a manner that the predetermined and prescribed concn. is attained. As a result, the continuous treatment of copper plating is made possible. |
| format | Patent |
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SOLUTION: This apparatus has a transportation control section for the plating apparatus for discretely controlling the racks to be charged into the plating 1 by one piece each and the plating cell 1 for making the concn. of the plating liquid in the plating cell uniform. Further, the apparatus has an automatic analysis adjustment control section having an automatic analyzer 15 which automatically analyzes the concn. of the plating liquid, predicts the change in the plating concn. after the charging from the number of the racks to be charged or the plating area simultaneously when the racks are charged from a rack transporting conveyor 8 and automatically controls the plating liquid in such a manner that the predetermined and prescribed concn. is attained. As a result, the continuous treatment of copper plating is made possible.</description><edition>6</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>1998</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980602&DB=EPODOC&CC=JP&NR=H10147883A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19980602&DB=EPODOC&CC=JP&NR=H10147883A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MATAHIRA HIROSHI</creatorcontrib><creatorcontrib>TAKAI EIJI</creatorcontrib><creatorcontrib>SASADA MASATO</creatorcontrib><creatorcontrib>OGAWARA TOSHIYUKI</creatorcontrib><creatorcontrib>NONAKA TAKAHIDE</creatorcontrib><title>CHEMICAL COPPER PLATING APPARATUS</title><description>PROBLEM TO BE SOLVED: To provide a chemical copper plating apparatus capable of decreasing the man-hours for plating work and shortening the staying time of printed circuit boards by making it possible to plate many kinds of the printed circuit boards with varying plating film thickness and making it possible to automate the analysis of a plating liquid, rack transportation, baking treatment after plating and rack release and history management. SOLUTION: This apparatus has a transportation control section for the plating apparatus for discretely controlling the racks to be charged into the plating 1 by one piece each and the plating cell 1 for making the concn. of the plating liquid in the plating cell uniform. Further, the apparatus has an automatic analysis adjustment control section having an automatic analyzer 15 which automatically analyzes the concn. of the plating liquid, predicts the change in the plating concn. after the charging from the number of the racks to be charged or the plating area simultaneously when the racks are charged from a rack transporting conveyor 8 and automatically controls the plating liquid in such a manner that the predetermined and prescribed concn. is attained. As a result, the continuous treatment of copper plating is made possible.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1998</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFB09nD19XR29FFw9g8IcA1SCPBxDPH0c1dwDAhwDHIMCQ3mYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEehgaGJuYWFsaOxsSoAQAZ5iJp</recordid><startdate>19980602</startdate><enddate>19980602</enddate><creator>MATAHIRA HIROSHI</creator><creator>TAKAI EIJI</creator><creator>SASADA MASATO</creator><creator>OGAWARA TOSHIYUKI</creator><creator>NONAKA TAKAHIDE</creator><scope>EVB</scope></search><sort><creationdate>19980602</creationdate><title>CHEMICAL COPPER PLATING APPARATUS</title><author>MATAHIRA HIROSHI ; TAKAI EIJI ; SASADA MASATO ; OGAWARA TOSHIYUKI ; NONAKA TAKAHIDE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH10147883A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1998</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>MATAHIRA HIROSHI</creatorcontrib><creatorcontrib>TAKAI EIJI</creatorcontrib><creatorcontrib>SASADA MASATO</creatorcontrib><creatorcontrib>OGAWARA TOSHIYUKI</creatorcontrib><creatorcontrib>NONAKA TAKAHIDE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MATAHIRA HIROSHI</au><au>TAKAI EIJI</au><au>SASADA MASATO</au><au>OGAWARA TOSHIYUKI</au><au>NONAKA TAKAHIDE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CHEMICAL COPPER PLATING APPARATUS</title><date>1998-06-02</date><risdate>1998</risdate><abstract>PROBLEM TO BE SOLVED: To provide a chemical copper plating apparatus capable of decreasing the man-hours for plating work and shortening the staying time of printed circuit boards by making it possible to plate many kinds of the printed circuit boards with varying plating film thickness and making it possible to automate the analysis of a plating liquid, rack transportation, baking treatment after plating and rack release and history management. SOLUTION: This apparatus has a transportation control section for the plating apparatus for discretely controlling the racks to be charged into the plating 1 by one piece each and the plating cell 1 for making the concn. of the plating liquid in the plating cell uniform. Further, the apparatus has an automatic analysis adjustment control section having an automatic analyzer 15 which automatically analyzes the concn. of the plating liquid, predicts the change in the plating concn. after the charging from the number of the racks to be charged or the plating area simultaneously when the racks are charged from a rack transporting conveyor 8 and automatically controls the plating liquid in such a manner that the predetermined and prescribed concn. is attained. As a result, the continuous treatment of copper plating is made possible.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| title | CHEMICAL COPPER PLATING APPARATUS |
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