ELECTROPLATING DEVICE

PROBLEM TO BE SOLVED: To provide an electroplating device with which plating thickness distributions are made uniform even with deformed metallic bars having ruggedness at their sections by mounting auxiliary cathode plates between the long- sized anode plates and cathode plates arranged in parallel...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AKINO HISANORI, NARASAKI MASAKAZU, YAGI YUJI, TOMOBE MASAKATSU, OZAKI TOSHINORI, NAKAMURA TOSHINOBU
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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