ELECTROPLATING DEVICE

PROBLEM TO BE SOLVED: To provide an electroplating device with which plating thickness distributions are made uniform even with deformed metallic bars having ruggedness at their sections by mounting auxiliary cathode plates between the long- sized anode plates and cathode plates arranged in parallel. SOLUTION: The metallic bar bodies 3 formed as the cathode plates are arranged in parallel with the anode plates 2 in a plating vessel 1. If the metallic bar bodies 3 are the deformed metallic bars having plate thickness parts 3c at their section, both sides in the upper and lower parts thereof are provided with shielding plates 4, 5. Plating current densities are regulated corresponding to the shapes of the metallic bar bodies 3. Further, fluid nozzles 7 are arranged in the lower part of the plating vessel, and air, etc., are ejected to fluidize a plating liquid 6. The spiral type auxiliary cathode electrode 8 are freely rotatable around the cathode electrodes as the axis of rotation near the edges of the metallic bar bodies 3 of the electroplating device. The spiral type auxiliary cathode electrodes 8 are preferably made freely vertically and laterally movable and the number of revolutions and the voltages with the anode electrodes are preferably made variable.