EQUIPMENT FOR MANUFACTURING BALL GRID ARRAY

PROBLEM TO BE SOLVED: To provide an equipment for manufacturing a ball grid array wherein flux is prevented from adhering to a mask, operation is continuously performed without being interrupted by a removal of defect, etc., and stable operation can be continued. SOLUTION: An equipment for manufactu...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: OGATA SHIGEYUKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide an equipment for manufacturing a ball grid array wherein flux is prevented from adhering to a mask, operation is continuously performed without being interrupted by a removal of defect, etc., and stable operation can be continued. SOLUTION: An equipment for manufacturing a ball grid array mounts fine solder balls 3 on a pattern 2 formed on a board 1. In the equipment, a supporting base 7 which supports the board 1 is provided and a mask 4 whereupon introducing holes for solder balls corresponding to the pattern 2 of the board 1 are formed is provided at the upper part of the board 1. The equipment is also provided with spacers 5 between the mask 4 and the board 1, a blade 6 which can slide horizontally on the top plane of the mask 4, and free-state solder balls 3 placed on the top plane of the mask 4. The solder balls 3 are dropped into the introducing holes of the mask 4 one by one by horizontally shifting the flexible blade 6, the remaining solder balls 3 are collected to one side of the mask 4 by clawing, and the solder balls 3 are mounted only on the necessary areas.