REMOVING METHOD AND DEVICE OF SLICE BASE

PROBLEM TO BE SOLVED: To instantaneously removes a slice base from a silicon wafer by a method in which liquid nitrogen is sprayed on adhesive agent which bonds the slice bar to the edge of the silicon wafer, or the slice base is dipped into liquid nitrogen. SOLUTION: A lid 3 is put on the top of a wafer holder 2. A slice base 11 and an adhesive agent 12 which bonds the slice base 11 to the orientation flat of a silicon wafer are exposed out of slits holes 11 provided to the lid 3. The nozzle 44 of a spray remover 4 is directed toward the exposed adhesive agent 12 and sprays liquid nitrogen on it. The adhesive agent 12 is quickly cooled down and separated off from the edge face of the orientation flat of a wafer main body 10 owing to a shrinkage factor difference between the adhesive agent 12 and the edge face of the wafer main body 10, thereby the slice base 11 is removed from the wafer main body 10.