NON-PLANAR CATHODE AND SUPPORTING DEVICE USING THE SAME AND PRODUCTION OF THIN FILM

PROBLEM TO BE SOLVED: To obtain cathodes capable of controlling the compsn. of thin films. SOLUTION: Sputtering is executed by arranging the bar-shaped cathodes 22 and the non-planar cathodes 12 formed by mounting plural pieces of these bar-shaped cathodes at a frame 23 apart spaced intervals betwee...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	SUWA HIDENORI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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