FORMATION OF TERMINAL ELECTRODE FOR SOLDER BUMP MOUNTING

PROBLEM TO BE SOLVED: To prevent solder from flowing into an interface between a wiring electrode pad and an insulating protective film and to reduce the number of fabricating steps to achieve low fabricating costs, by forming the insulating protective film and then making the insulating film act as...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SATO NOBUO, HOSOYA MASAKAZE, TSUNETSUGU HIDEKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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