COMPOSITE SEMICONDUCTOR SUBSTRATE

PROBLEM TO BE SOLVED: To provide a composite semiconductor substrate which is small in warp even in case of large wafer diameter. SOLUTION: In a composite semiconductor substrate where one or more pieces, separated from one another, of single-crystal semiconductor regions 11 and a supporting substra...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUJII KAZUHIRO, SHIMIZU MICHIMASA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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