SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a thin semiconductor device with good mechanical strength, by forming a spot facing region for mounting a semiconductor chip and a passive component. SOLUTION: A wiring board 10 has at least each spot facing region 13a or 13b on a major surface for mounting a wiring part 10a including a connection part, a semiconductor 11, and a passive component 12, while a flat outer-side connection terminal 10b is provided on the other face. A semiconductor chip 11 is mounted in a face-up state at the spot facing part 13a or 13b and connected electrically to a wiring part 10a that includes the necessary connection part. The passive component 12 is fixed at a central part of the spot facing region 13b, while terminals are insulated from each other. A space including part of the spot facing region 13b are filled with conductive composition layer 15b, and both terminals are connected to each corresponding connection part 10a. The region, on which the semiconductor chip 11 and the passive component 12 are mounted, is covered in a sealed state with a sealing resin layer.