MANUFACTURE OF CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board where a wiring pattern and a conductive member can be electrically and surely connected together. SOLUTION: A circuit board 1 is formed of a laminate composed, of insulating boards, wherein a wiring pattern 3 is formed on the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KATAYAMA TOSHIHIRO, KATOU SEIJI
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of manufacturing a circuit board where a wiring pattern and a conductive member can be electrically and surely connected together. SOLUTION: A circuit board 1 is formed of a laminate composed, of insulating boards, wherein a wiring pattern 3 is formed on the surface of the laminate or between the insulating boards. A through-hole 5 is provided to a point where the wiring patterns are required to be electrically connected together, and conductive member is filled in through-hole 5. In this case, a manufacturing process where a circuit board is formed is composed of a first process where a wiring pattern inside the through-hole 5 is surface-treated with coupling agent and a second process where conductive member is filled in the through-hole 5 where the wiring pattern is previously subjected to a surface treatment.