ELECTRONIC PART MOUNTING SUBSTRATE AND MANUFACTURE THEREOF

ELECTRONIC PART MOUNTING SUBSTRATE AND MANUFACTURE THEREOF

PROBLEM TO BE SOLVED: To secure a low inductance mounting area sufficient to mount an electronic part. SOLUTION: A core substrate 5 provided with a mounting hole 50 used to mount an electronic part, bonding pads 11, 21 and 31, to be used for grounding, a signal and power source provided around the m...

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1. Verfasser: TAKADA MASATOME
Format: Patent
Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator TAKADA MASATOME
description PROBLEM TO BE SOLVED: To secure a low inductance mounting area sufficient to mount an electronic part. SOLUTION: A core substrate 5 provided with a mounting hole 50 used to mount an electronic part, bonding pads 11, 21 and 31, to be used for grounding, a signal and power source provided around the mounting hole, and patterns 13, 22 and 32, to be used for grounding, signal and power source, are provided. A grounding side-face through hole 51, with which between the grounding bonding pad provided on the upper surface of the core substrate and the grounding circuit pattern provided on the lower surface of the core substrate are conducted, is provided on the wall surface 500 of the mounting hole. Resin 59 is filled in the internal part of a grounding circuit pattern.
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SOLUTION: A core substrate 5 provided with a mounting hole 50 used to mount an electronic part, bonding pads 11, 21 and 31, to be used for grounding, a signal and power source provided around the mounting hole, and patterns 13, 22 and 32, to be used for grounding, signal and power source, are provided. A grounding side-face through hole 51, with which between the grounding bonding pad provided on the upper surface of the core substrate and the grounding circuit pattern provided on the lower surface of the core substrate are conducted, is provided on the wall surface 500 of the mounting hole. Resin 59 is filled in the internal part of a grounding circuit pattern.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title ELECTRONIC PART MOUNTING SUBSTRATE AND MANUFACTURE THEREOF
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