TWO-LAYER TYPE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PROBLEM TO BE SOLVED: To obtain a very fine circuit pattern at a high yield by specifying the number and max. length of through-holes piercing a two-layer type printed circuit board and conductive metal layer to reach the surface of an insulation film. SOLUTION: A conductive metal layer 2 is formed...

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Hauptverfasser:	TOYAMA SHUNROKU, NISHIKAWA TADAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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creator	TOYAMA SHUNROKU NISHIKAWA TADAHIRO
description	PROBLEM TO BE SOLVED: To obtain a very fine circuit pattern at a high yield by specifying the number and max. length of through-holes piercing a two-layer type printed circuit board and conductive metal layer to reach the surface of an insulation film. SOLUTION: A conductive metal layer 2 is formed on an insulation film 1 and chemically adsorbed pref. through a water soln. to pin-holes through which the film 1 is exposed, i.e., defects of this metal layer 2 and, if required, to bored throughholes to expose the film 1, and then the electroplating is made to obtain a two-layer type printed board. It is specified that the number and max. length of pin-holes of this board are 10 holes/m or less and 10 microns or less as measured with the transmitted light and steromicroscope. Thus it is possible to produce a fine pattern with through-holes of 80 microns or less pitch at a high yield which was difficult to mass-produce, whereby more highdensity and more high-integration degree electric and electronic apparatus are expectable.
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SOLUTION: A conductive metal layer 2 is formed on an insulation film 1 and chemically adsorbed pref. through a water soln. to pin-holes through which the film 1 is exposed, i.e., defects of this metal layer 2 and, if required, to bored throughholes to expose the film 1, and then the electroplating is made to obtain a two-layer type printed board. It is specified that the number and max. length of pin-holes of this board are 10 holes/m or less and 10 microns or less as measured with the transmitted light and steromicroscope. 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subjects	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
title	TWO-LAYER TYPE PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
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