RADIATOR MOUNTING STRUCTURE
PROBLEM TO BE SOLVED: To prevent the slant, the loosening, the fall or the like of a radiator from being generated on a printed board at the time of soldering of the radiator in a radiator mounting structure to the printed board. SOLUTION: One part of a radiator main body part 2, which is previously...
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creator | YAMABE TOSHIYUKI SAITO YOSHIHIRO |
description | PROBLEM TO BE SOLVED: To prevent the slant, the loosening, the fall or the like of a radiator from being generated on a printed board at the time of soldering of the radiator in a radiator mounting structure to the printed board. SOLUTION: One part of a radiator main body part 2, which is previously mounted with artificial legs (soldered terminals) 3 of a radiator 1 and a semiconductor heating element 4, is made to fit in a roughly U-shaped part 6 of a self-supporting terminal 5 and at the same time, after the artificial legs 3 of the radiator 1 are inserted in a printed board 9, lead legs 7 of the terminal 5 and the artificial legs 3 of the radiator are simultaneously soldered to a copper foil (is not shown in the diagram) for soldering use of the board 9 using an automatic soldering device or the like, whereby the slant, the loosening, the fall or the like of the radiator 1 at the time of the soldering can be prevented from being generated and the radiator 1 is mounted to the board 9 and can be fixed on the board 9 in a self-supporting stable manner. |
format | Patent |
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SOLUTION: One part of a radiator main body part 2, which is previously mounted with artificial legs (soldered terminals) 3 of a radiator 1 and a semiconductor heating element 4, is made to fit in a roughly U-shaped part 6 of a self-supporting terminal 5 and at the same time, after the artificial legs 3 of the radiator 1 are inserted in a printed board 9, lead legs 7 of the terminal 5 and the artificial legs 3 of the radiator are simultaneously soldered to a copper foil (is not shown in the diagram) for soldering use of the board 9 using an automatic soldering device or the like, whereby the slant, the loosening, the fall or the like of the radiator 1 at the time of the soldering can be prevented from being generated and the radiator 1 is mounted to the board 9 and can be fixed on the board 9 in a self-supporting stable manner.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19971031&DB=EPODOC&CC=JP&NR=H09283672A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19971031&DB=EPODOC&CC=JP&NR=H09283672A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAMABE TOSHIYUKI</creatorcontrib><creatorcontrib>SAITO YOSHIHIRO</creatorcontrib><title>RADIATOR MOUNTING STRUCTURE</title><description>PROBLEM TO BE SOLVED: To prevent the slant, the loosening, the fall or the like of a radiator from being generated on a printed board at the time of soldering of the radiator in a radiator mounting structure to the printed board. SOLUTION: One part of a radiator main body part 2, which is previously mounted with artificial legs (soldered terminals) 3 of a radiator 1 and a semiconductor heating element 4, is made to fit in a roughly U-shaped part 6 of a self-supporting terminal 5 and at the same time, after the artificial legs 3 of the radiator 1 are inserted in a printed board 9, lead legs 7 of the terminal 5 and the artificial legs 3 of the radiator are simultaneously soldered to a copper foil (is not shown in the diagram) for soldering use of the board 9 using an automatic soldering device or the like, whereby the slant, the loosening, the fall or the like of the radiator 1 at the time of the soldering can be prevented from being generated and the radiator 1 is mounted to the board 9 and can be fixed on the board 9 in a self-supporting stable manner.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAOcnTxdAzxD1Lw9Q_1C_H0c1cIDgkKdQ4JDXLlYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxQWJyal5qSXxXgEeBpZGFsZm5kaOxsSoAQB7BCEm</recordid><startdate>19971031</startdate><enddate>19971031</enddate><creator>YAMABE TOSHIYUKI</creator><creator>SAITO YOSHIHIRO</creator><scope>EVB</scope></search><sort><creationdate>19971031</creationdate><title>RADIATOR MOUNTING STRUCTURE</title><author>YAMABE TOSHIYUKI ; SAITO YOSHIHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH09283672A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1997</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMABE TOSHIYUKI</creatorcontrib><creatorcontrib>SAITO YOSHIHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAMABE TOSHIYUKI</au><au>SAITO YOSHIHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RADIATOR MOUNTING STRUCTURE</title><date>1997-10-31</date><risdate>1997</risdate><abstract>PROBLEM TO BE SOLVED: To prevent the slant, the loosening, the fall or the like of a radiator from being generated on a printed board at the time of soldering of the radiator in a radiator mounting structure to the printed board. SOLUTION: One part of a radiator main body part 2, which is previously mounted with artificial legs (soldered terminals) 3 of a radiator 1 and a semiconductor heating element 4, is made to fit in a roughly U-shaped part 6 of a self-supporting terminal 5 and at the same time, after the artificial legs 3 of the radiator 1 are inserted in a printed board 9, lead legs 7 of the terminal 5 and the artificial legs 3 of the radiator are simultaneously soldered to a copper foil (is not shown in the diagram) for soldering use of the board 9 using an automatic soldering device or the like, whereby the slant, the loosening, the fall or the like of the radiator 1 at the time of the soldering can be prevented from being generated and the radiator 1 is mounted to the board 9 and can be fixed on the board 9 in a self-supporting stable manner.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
title | RADIATOR MOUNTING STRUCTURE |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T01%3A00%3A45IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=YAMABE%20TOSHIYUKI&rft.date=1997-10-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH09283672A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |