COPPER ALLOY FOR TERMINAL, REDUCED IN CONTACT RESISTANCE AFTER STANDING AT HIGH TEMPERATURE

PROBLEM TO BE SOLVED: To obtain a copper alloy for terminal, capable of inhibiting an increase in contact resistance after standing at the service temp. of a terminal even if Sn plating is omitted, by adding proper amounts of Zn to a Cu-Fe-P alloy. SOLUTION: This copper alloy is an alloy consisting...

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Bibliographische Detailangaben

Hauptverfasser:	MIYATO MOTOHISA, OGURA TETSUZO
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS CURRENT COLLECTORS ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INSULATORS LINE CONNECTORS METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TREATMENT OF ALLOYS OR NON-FERROUS METALS
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