MANUFACTURE OF ALUMINUM NITRIDE CIRCUIT BOARD
PROBLEM TO BE SOLVED: To produce a low cost copper-clad AlN circuit board excellent in bond strength to a copper plate and alkaline corrosion resistance, and having excellent thermal conductivity to be capable of sintering the board at a lower temperature range of 1,600 to 1,700 deg.C. SOLUTION: In...
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| creator | HAMANO AKIHIRO NOZAKI TOSHIO MINO KATSUJI |
| description | PROBLEM TO BE SOLVED: To produce a low cost copper-clad AlN circuit board excellent in bond strength to a copper plate and alkaline corrosion resistance, and having excellent thermal conductivity to be capable of sintering the board at a lower temperature range of 1,600 to 1,700 deg.C. SOLUTION: In this manufacture, to powdery aluminum nitride(AlN), a sintering aid which contains an aluminum compound, a calcium compound and an yttrium compound in contents sufficient to provide a 35 to 70mol% aluminum compound molar ratio expressed in terms of Al2 O3 (including Al2 O3 in the powdery AlN), a 20 to 60mol% calcium compound molar ratio in terms of CaO and a 5 to 30mol% yttrium compound molar ratio in terms of Y2 O3 is added. The resulting mixture is sintered at a temp. in the range of 1,600 to 1,700 deg.C to manufacture an AlN board and thereafter, a copper sheet is joined to the resulting AlN board. |
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SOLUTION: In this manufacture, to powdery aluminum nitride(AlN), a sintering aid which contains an aluminum compound, a calcium compound and an yttrium compound in contents sufficient to provide a 35 to 70mol% aluminum compound molar ratio expressed in terms of Al2 O3 (including Al2 O3 in the powdery AlN), a 20 to 60mol% calcium compound molar ratio in terms of CaO and a 5 to 30mol% yttrium compound molar ratio in terms of Y2 O3 is added. The resulting mixture is sintered at a temp. in the range of 1,600 to 1,700 deg.C to manufacture an AlN board and thereafter, a copper sheet is joined to the resulting AlN board.</description><edition>6</edition><language>eng</language><subject>ARTIFICIAL STONE ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CEMENTS ; CERAMICS ; CHEMISTRY ; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS ; CONCRETE ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LIME, MAGNESIA ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; REFRACTORIES ; SLAG ; TREATMENT OF NATURAL STONE</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19971007&DB=EPODOC&CC=JP&NR=H09263456A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19971007&DB=EPODOC&CC=JP&NR=H09263456A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAMANO AKIHIRO</creatorcontrib><creatorcontrib>NOZAKI TOSHIO</creatorcontrib><creatorcontrib>MINO KATSUJI</creatorcontrib><title>MANUFACTURE OF ALUMINUM NITRIDE CIRCUIT BOARD</title><description>PROBLEM TO BE SOLVED: To produce a low cost copper-clad AlN circuit board excellent in bond strength to a copper plate and alkaline corrosion resistance, and having excellent thermal conductivity to be capable of sintering the board at a lower temperature range of 1,600 to 1,700 deg.C. SOLUTION: In this manufacture, to powdery aluminum nitride(AlN), a sintering aid which contains an aluminum compound, a calcium compound and an yttrium compound in contents sufficient to provide a 35 to 70mol% aluminum compound molar ratio expressed in terms of Al2 O3 (including Al2 O3 in the powdery AlN), a 20 to 60mol% calcium compound molar ratio in terms of CaO and a 5 to 30mol% yttrium compound molar ratio in terms of Y2 O3 is added. 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SOLUTION: In this manufacture, to powdery aluminum nitride(AlN), a sintering aid which contains an aluminum compound, a calcium compound and an yttrium compound in contents sufficient to provide a 35 to 70mol% aluminum compound molar ratio expressed in terms of Al2 O3 (including Al2 O3 in the powdery AlN), a 20 to 60mol% calcium compound molar ratio in terms of CaO and a 5 to 30mol% yttrium compound molar ratio in terms of Y2 O3 is added. The resulting mixture is sintered at a temp. in the range of 1,600 to 1,700 deg.C to manufacture an AlN board and thereafter, a copper sheet is joined to the resulting AlN board.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ARTIFICIAL STONE CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS REFRACTORIES SLAG TREATMENT OF NATURAL STONE |
| title | MANUFACTURE OF ALUMINUM NITRIDE CIRCUIT BOARD |
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