METHOD FOR TREATING SURFACE OF LEAD FRAME

PROBLEM TO BE SOLVED: To provide a method for treating the surface of a lead frame by which a mechanical connecting strength, solder wettability, and excellent die bonding or wire bonding position recognizability can be given to the surface of a single plated Ag film. SOLUTION: In a method for treat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	AKINO HISANORI, TOMOBE MASAKATSU, YOSHIDA KAZUYUKI, KOIZUMI RYOICHI, OZAKI TOSHINORI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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