METHOD FOR TREATING SURFACE OF LEAD FRAME
PROBLEM TO BE SOLVED: To provide a method for treating the surface of a lead frame by which a mechanical connecting strength, solder wettability, and excellent die bonding or wire bonding position recognizability can be given to the surface of a single plated Ag film. SOLUTION: In a method for treat...
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| creator | AKINO HISANORI TOMOBE MASAKATSU YOSHIDA KAZUYUKI KOIZUMI RYOICHI OZAKI TOSHINORI |
| description | PROBLEM TO BE SOLVED: To provide a method for treating the surface of a lead frame by which a mechanical connecting strength, solder wettability, and excellent die bonding or wire bonding position recognizability can be given to the surface of a single plated Ag film. SOLUTION: In a method for treating the surface of a lead frame 1 which is partially coated with a plated AG film, the degree of oxidation of an Ag oxide layer formed at a die bonding place 7, a wire bonding place 8, and specific places 9a and 9b near the places 7 and 8 on the surface of the plated AG film are electrochemically changed. Therefore, glossy to semi-glossy surfaces, semi- glossy to non-glossy surfaces, and non-glossy surfaces can be formed on the surface of the plated AG film. |
| format | Patent |
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| subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES |
| title | METHOD FOR TREATING SURFACE OF LEAD FRAME |
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