METHOD FOR SOLDERING ELECTRONIC PARTS

PROBLEM TO BE SOLVED: To highly uniformly, quickly, and economically solder electronic parts, etc., with leads to an electric circuit board by spraying molten solder upon the circuit board from a solder spraying port while the inside of a cover which spatially covers the circuit board from the circumference is evacuated with an aspirator. SOLUTION: A cover 5 which spatially covers an electric circuit board 9 from the circumference is provided and electronic parts, etc., are soldered to the board 9 while the inside of the cover 5 is evacuated with an evacuator 8. Because of the evacuating force of the evacuator 8, molten solder sprayed upon the electronic parts is made to uniformly and quickly intrude into gaps between the circuit board and lead parts, etc. In addition, the electronic parts arranged at narrow intervals can be soldered to the circuit board without causing short circuits not giving any influence to the surface mounted electronic parts, because the solder and flux are not scattered at random.