MANUFACTURE OF SEMICONDUCTOR ELEMENT IN WHICH REAR SURFACE OF WAFER IS POLISHED BY UV OVERSENSITIVE TAPE

PROBLEM TO BE SOLVED: To avoid using other chemical substance for removing an UV-sensitive tape, etc., from a semiconductor wafer by removing the tape with irradiation of ultraviolet rays on the surface of the wafer by a new wafer back side polishing step. SOLUTION: An UV-sensible tape 35 is laid on...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOU DOIN, CHIN SEIMIN
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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