METHOD AND APPARATUS FOR EXPOSING PERIPHERAL PART OF SUBSTRATE
PROBLEM TO BE SOLVED: To sustain the profile of alignment mark formed in a fringe region on a substrate by deciding whether exposure is required for a photosensitive layer covering the mark depending on the post-processing of substrate onto which a pattern is transferred thereby protecting the mark...
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| creator | KAWAKUBO SHOJI |
| description | PROBLEM TO BE SOLVED: To sustain the profile of alignment mark formed in a fringe region on a substrate by deciding whether exposure is required for a photosensitive layer covering the mark depending on the post-processing of substrate onto which a pattern is transferred thereby protecting the mark in the post-processing system. SOLUTION: A reference mark 110 is formed in lattice in the longitudinal direction of laser illumination spot 504 projected from a laser alignment optical system and the mark 110 is put in the periphery of a region for forming a circuit pattern. An input unit at main control section 400 decides whether the reference mark 110 is exposed or not and controls a shutter 610 through a driver 612 based on the exposure control information stored in a peripheral exposure control section 618 and memory section 620. More specifically, a wafer W is coated with positive resist and the reference mark 110 is not exposed when it is better to leave the resist on the reference mark 110. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH09115816A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH09115816A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH09115816A3</originalsourceid><addsrcrecordid>eNrjZLDzdQ3x8HdRcPQD4oAAxyDHkNBgBTf_IAXXiAD_YE8_d4UA1yDPAA_XIEcfBaB8iIK_m0JwqFNwCFCpKw8Da1piTnEqL5TmZlB0cw1x9tBNLciPTy0uSExOzUstifcK8DCwNDQ0tTA0czQmRg0AZyUqcw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD AND APPARATUS FOR EXPOSING PERIPHERAL PART OF SUBSTRATE</title><source>esp@cenet</source><creator>KAWAKUBO SHOJI</creator><creatorcontrib>KAWAKUBO SHOJI</creatorcontrib><description>PROBLEM TO BE SOLVED: To sustain the profile of alignment mark formed in a fringe region on a substrate by deciding whether exposure is required for a photosensitive layer covering the mark depending on the post-processing of substrate onto which a pattern is transferred thereby protecting the mark in the post-processing system. SOLUTION: A reference mark 110 is formed in lattice in the longitudinal direction of laser illumination spot 504 projected from a laser alignment optical system and the mark 110 is put in the periphery of a region for forming a circuit pattern. An input unit at main control section 400 decides whether the reference mark 110 is exposed or not and controls a shutter 610 through a driver 612 based on the exposure control information stored in a peripheral exposure control section 618 and memory section 620. More specifically, a wafer W is coated with positive resist and the reference mark 110 is not exposed when it is better to leave the resist on the reference mark 110.</description><edition>6</edition><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970502&DB=EPODOC&CC=JP&NR=H09115816A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970502&DB=EPODOC&CC=JP&NR=H09115816A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWAKUBO SHOJI</creatorcontrib><title>METHOD AND APPARATUS FOR EXPOSING PERIPHERAL PART OF SUBSTRATE</title><description>PROBLEM TO BE SOLVED: To sustain the profile of alignment mark formed in a fringe region on a substrate by deciding whether exposure is required for a photosensitive layer covering the mark depending on the post-processing of substrate onto which a pattern is transferred thereby protecting the mark in the post-processing system. SOLUTION: A reference mark 110 is formed in lattice in the longitudinal direction of laser illumination spot 504 projected from a laser alignment optical system and the mark 110 is put in the periphery of a region for forming a circuit pattern. An input unit at main control section 400 decides whether the reference mark 110 is exposed or not and controls a shutter 610 through a driver 612 based on the exposure control information stored in a peripheral exposure control section 618 and memory section 620. More specifically, a wafer W is coated with positive resist and the reference mark 110 is not exposed when it is better to leave the resist on the reference mark 110.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDzdQ3x8HdRcPQD4oAAxyDHkNBgBTf_IAXXiAD_YE8_d4UA1yDPAA_XIEcfBaB8iIK_m0JwqFNwCFCpKw8Da1piTnEqL5TmZlB0cw1x9tBNLciPTy0uSExOzUstifcK8DCwNDQ0tTA0czQmRg0AZyUqcw</recordid><startdate>19970502</startdate><enddate>19970502</enddate><creator>KAWAKUBO SHOJI</creator><scope>EVB</scope></search><sort><creationdate>19970502</creationdate><title>METHOD AND APPARATUS FOR EXPOSING PERIPHERAL PART OF SUBSTRATE</title><author>KAWAKUBO SHOJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH09115816A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1997</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KAWAKUBO SHOJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KAWAKUBO SHOJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD AND APPARATUS FOR EXPOSING PERIPHERAL PART OF SUBSTRATE</title><date>1997-05-02</date><risdate>1997</risdate><abstract>PROBLEM TO BE SOLVED: To sustain the profile of alignment mark formed in a fringe region on a substrate by deciding whether exposure is required for a photosensitive layer covering the mark depending on the post-processing of substrate onto which a pattern is transferred thereby protecting the mark in the post-processing system. SOLUTION: A reference mark 110 is formed in lattice in the longitudinal direction of laser illumination spot 504 projected from a laser alignment optical system and the mark 110 is put in the periphery of a region for forming a circuit pattern. An input unit at main control section 400 decides whether the reference mark 110 is exposed or not and controls a shutter 610 through a driver 612 based on the exposure control information stored in a peripheral exposure control section 618 and memory section 620. More specifically, a wafer W is coated with positive resist and the reference mark 110 is not exposed when it is better to leave the resist on the reference mark 110.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
| title | METHOD AND APPARATUS FOR EXPOSING PERIPHERAL PART OF SUBSTRATE |
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