GLASS CLOTH, PREPREG, LAMINATED BOARD AND MULTILAYER PRINTED CIRCUIT BOARD
PROBLEM TO BE SOLVED: To obtain a prepreg, a laminated board and a multilayer printed circuit board by using a glass cloth having improved tear strength even in a thin state and woven by using warp or weft thicker than the other weft or warp and decreasing the count of the thicker strand. SOLUTION:...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | SAKAGUCHI KOZO NAGAMINE FUMIO HIBINO AKINORI MIYASATO KEITA HATTORI HIROMASA WATANABE TATSUYA |
| description | PROBLEM TO BE SOLVED: To obtain a prepreg, a laminated board and a multilayer printed circuit board by using a glass cloth having improved tear strength even in a thin state and woven by using warp or weft thicker than the other weft or warp and decreasing the count of the thicker strand. SOLUTION: A two ply yarn or a single yarn having a filament diameter of 0.003-0.010mm is used as the strand of warp and/or weft. The weft or the warp is composed of a strand of >=75de which is thicker than the other warp or weft, the count of the strand of the weft or warp per unit length is set to be smaller, i.e., 0.3-0.8 times the count of the other warp or weft and the weight of the thicker strand of the weft or warp per unit length is set to be 1.5-2.5 times that of the other warp or weft to obtain a woven thin glass cloth having an areal density of 15-30g/m . The cloth is impregnated with 60-80wt.% (based on the weight of prepreg) of an epoxy resin and the obtained prepreg is hot- pressed together with a metallic foil to form a laminated board having an insulation layer thickness of 0.040-0.080mm and a tear strength of >=35gf. A multilayer printed circuit board is manufactured from the laminated board. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH09111577A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH09111577A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH09111577A3</originalsourceid><addsrcrecordid>eNrjZPBy93EMDlZw9vEP8dBRCAhyBSJ3HQUfR19PP8cQVxcFJ3_HIBcFRz8XBd9QnxBPH8dI1yCgOk8_kKSzZ5BzqGcIRBEPA2taYk5xKi-U5mZQdHMNcfbQTS3Ij08tLkhMTs1LLYn3CvAwsDQ0NDQ1N3c0JkYNADukLVU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>GLASS CLOTH, PREPREG, LAMINATED BOARD AND MULTILAYER PRINTED CIRCUIT BOARD</title><source>esp@cenet</source><creator>SAKAGUCHI KOZO ; NAGAMINE FUMIO ; HIBINO AKINORI ; MIYASATO KEITA ; HATTORI HIROMASA ; WATANABE TATSUYA</creator><creatorcontrib>SAKAGUCHI KOZO ; NAGAMINE FUMIO ; HIBINO AKINORI ; MIYASATO KEITA ; HATTORI HIROMASA ; WATANABE TATSUYA</creatorcontrib><description>PROBLEM TO BE SOLVED: To obtain a prepreg, a laminated board and a multilayer printed circuit board by using a glass cloth having improved tear strength even in a thin state and woven by using warp or weft thicker than the other weft or warp and decreasing the count of the thicker strand. SOLUTION: A two ply yarn or a single yarn having a filament diameter of 0.003-0.010mm is used as the strand of warp and/or weft. The weft or the warp is composed of a strand of >=75de which is thicker than the other warp or weft, the count of the strand of the weft or warp per unit length is set to be smaller, i.e., 0.3-0.8 times the count of the other warp or weft and the weight of the thicker strand of the weft or warp per unit length is set to be 1.5-2.5 times that of the other warp or weft to obtain a woven thin glass cloth having an areal density of 15-30g/m . The cloth is impregnated with 60-80wt.% (based on the weight of prepreg) of an epoxy resin and the obtained prepreg is hot- pressed together with a metallic foil to form a laminated board having an insulation layer thickness of 0.040-0.080mm and a tear strength of >=35gf. A multilayer printed circuit board is manufactured from the laminated board.</description><edition>6</edition><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR ; GENERAL PROCESSES OF COMPOUNDING ; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC ; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS ; LAUNDERING ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; LOOMS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; METHODS OF WEAVING ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ; TECHNICAL SUBJECTS COVERED BY FORMER USPC ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS ; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS ; TEXTILES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; TREATMENT OF TEXTILES OR THE LIKE ; TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS,FABRICS, FEATHERS, OR FIBROUS GOODS MADE FROM SUCH MATERIALS ; WEAVING ; WORKING-UP ; WOVEN FABRICS</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970428&DB=EPODOC&CC=JP&NR=H09111577A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970428&DB=EPODOC&CC=JP&NR=H09111577A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SAKAGUCHI KOZO</creatorcontrib><creatorcontrib>NAGAMINE FUMIO</creatorcontrib><creatorcontrib>HIBINO AKINORI</creatorcontrib><creatorcontrib>MIYASATO KEITA</creatorcontrib><creatorcontrib>HATTORI HIROMASA</creatorcontrib><creatorcontrib>WATANABE TATSUYA</creatorcontrib><title>GLASS CLOTH, PREPREG, LAMINATED BOARD AND MULTILAYER PRINTED CIRCUIT BOARD</title><description>PROBLEM TO BE SOLVED: To obtain a prepreg, a laminated board and a multilayer printed circuit board by using a glass cloth having improved tear strength even in a thin state and woven by using warp or weft thicker than the other weft or warp and decreasing the count of the thicker strand. SOLUTION: A two ply yarn or a single yarn having a filament diameter of 0.003-0.010mm is used as the strand of warp and/or weft. The weft or the warp is composed of a strand of >=75de which is thicker than the other warp or weft, the count of the strand of the weft or warp per unit length is set to be smaller, i.e., 0.3-0.8 times the count of the other warp or weft and the weight of the thicker strand of the weft or warp per unit length is set to be 1.5-2.5 times that of the other warp or weft to obtain a woven thin glass cloth having an areal density of 15-30g/m . The cloth is impregnated with 60-80wt.% (based on the weight of prepreg) of an epoxy resin and the obtained prepreg is hot- pressed together with a metallic foil to form a laminated board having an insulation layer thickness of 0.040-0.080mm and a tear strength of >=35gf. A multilayer printed circuit board is manufactured from the laminated board.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</subject><subject>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</subject><subject>LAUNDERING</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>LOOMS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>METHODS OF WEAVING</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</subject><subject>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</subject><subject>TEXTILES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF TEXTILES OR THE LIKE</subject><subject>TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS,FABRICS, FEATHERS, OR FIBROUS GOODS MADE FROM SUCH MATERIALS</subject><subject>WEAVING</subject><subject>WORKING-UP</subject><subject>WOVEN FABRICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPBy93EMDlZw9vEP8dBRCAhyBSJ3HQUfR19PP8cQVxcFJ3_HIBcFRz8XBd9QnxBPH8dI1yCgOk8_kKSzZ5BzqGcIRBEPA2taYk5xKi-U5mZQdHMNcfbQTS3Ij08tLkhMTs1LLYn3CvAwsDQ0NDQ1N3c0JkYNADukLVU</recordid><startdate>19970428</startdate><enddate>19970428</enddate><creator>SAKAGUCHI KOZO</creator><creator>NAGAMINE FUMIO</creator><creator>HIBINO AKINORI</creator><creator>MIYASATO KEITA</creator><creator>HATTORI HIROMASA</creator><creator>WATANABE TATSUYA</creator><scope>EVB</scope></search><sort><creationdate>19970428</creationdate><title>GLASS CLOTH, PREPREG, LAMINATED BOARD AND MULTILAYER PRINTED CIRCUIT BOARD</title><author>SAKAGUCHI KOZO ; NAGAMINE FUMIO ; HIBINO AKINORI ; MIYASATO KEITA ; HATTORI HIROMASA ; WATANABE TATSUYA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH09111577A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1997</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC</topic><topic>GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS</topic><topic>LAUNDERING</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>LOOMS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>METHODS OF WEAVING</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS</topic><topic>TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS</topic><topic>TEXTILES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF TEXTILES OR THE LIKE</topic><topic>TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS,FABRICS, FEATHERS, OR FIBROUS GOODS MADE FROM SUCH MATERIALS</topic><topic>WEAVING</topic><topic>WORKING-UP</topic><topic>WOVEN FABRICS</topic><toplevel>online_resources</toplevel><creatorcontrib>SAKAGUCHI KOZO</creatorcontrib><creatorcontrib>NAGAMINE FUMIO</creatorcontrib><creatorcontrib>HIBINO AKINORI</creatorcontrib><creatorcontrib>MIYASATO KEITA</creatorcontrib><creatorcontrib>HATTORI HIROMASA</creatorcontrib><creatorcontrib>WATANABE TATSUYA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SAKAGUCHI KOZO</au><au>NAGAMINE FUMIO</au><au>HIBINO AKINORI</au><au>MIYASATO KEITA</au><au>HATTORI HIROMASA</au><au>WATANABE TATSUYA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GLASS CLOTH, PREPREG, LAMINATED BOARD AND MULTILAYER PRINTED CIRCUIT BOARD</title><date>1997-04-28</date><risdate>1997</risdate><abstract>PROBLEM TO BE SOLVED: To obtain a prepreg, a laminated board and a multilayer printed circuit board by using a glass cloth having improved tear strength even in a thin state and woven by using warp or weft thicker than the other weft or warp and decreasing the count of the thicker strand. SOLUTION: A two ply yarn or a single yarn having a filament diameter of 0.003-0.010mm is used as the strand of warp and/or weft. The weft or the warp is composed of a strand of >=75de which is thicker than the other warp or weft, the count of the strand of the weft or warp per unit length is set to be smaller, i.e., 0.3-0.8 times the count of the other warp or weft and the weight of the thicker strand of the weft or warp per unit length is set to be 1.5-2.5 times that of the other warp or weft to obtain a woven thin glass cloth having an areal density of 15-30g/m . The cloth is impregnated with 60-80wt.% (based on the weight of prepreg) of an epoxy resin and the obtained prepreg is hot- pressed together with a metallic foil to form a laminated board having an insulation layer thickness of 0.040-0.080mm and a tear strength of >=35gf. A multilayer printed circuit board is manufactured from the laminated board.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPH09111577A |
| source | esp@cenet |
| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FLEXIBLE MATERIALS NOT OTHERWISE PROVIDED FOR GENERAL PROCESSES OF COMPOUNDING GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS LAUNDERING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LOOMS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY METHODS OF WEAVING ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION TECHNICAL SUBJECTS COVERED BY FORMER USPC TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ARTCOLLECTIONS [XRACs] AND DIGESTS TEXTILES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING TREATMENT OF TEXTILES OR THE LIKE TREATMENT, NOT PROVIDED FOR ELSEWHERE IN CLASS D06, OF FIBRES, THREADS, YARNS,FABRICS, FEATHERS, OR FIBROUS GOODS MADE FROM SUCH MATERIALS WEAVING WORKING-UP WOVEN FABRICS |
| title | GLASS CLOTH, PREPREG, LAMINATED BOARD AND MULTILAYER PRINTED CIRCUIT BOARD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-13T03%3A45%3A54IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SAKAGUCHI%20KOZO&rft.date=1997-04-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH09111577A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |