LASER BEAM PROCESSING METHOD

PURPOSE: To form a via hole of a desired depth and diameter at a multilayered wiring board with good accuracy by concentrically irradiating this wiring board with a laser beam and detecting the main peak of the intrinsic line spectrum generated in an inner layer conductor formed with this hole. CONS...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SATO HIDEMI, TAIKO YOICHI, TERABAYASHI TAKAO, AMAMIYA KYOKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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