ALUMINA CERAMIC LID
PROBLEM TO BE SOLVED: To enhance the folding strength of an alumina ceramic lid which seals the cavity of a ceramic package. SOLUTION: An alumina ceramic lid 14 is bonded with solder 15 to the top face of a ceramic package 11 to seal its cavity 12. Primary grain of alumina, the raw material of the l...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | NOZAKI TOSHIO SHIGEMURA SHUJI MINO KATSUJI |
| description | PROBLEM TO BE SOLVED: To enhance the folding strength of an alumina ceramic lid which seals the cavity of a ceramic package. SOLUTION: An alumina ceramic lid 14 is bonded with solder 15 to the top face of a ceramic package 11 to seal its cavity 12. Primary grain of alumina, the raw material of the lid 14, is pulverized into a fine grain of 1-2 microns in a mean grain size and press-formed (after decay) to increase the contact points of the primary grain, thereby improving the sintering property. It is more treated to provide a sharp grain size distribution having D10-D90 (accumulated 10% and 90% grain sizes from the fine grain side) within ±70% of the mean grain size. Owing to this, the primary grain is roughly charged in the granular material before press-forming, thereby increasing the porosity to lower the granular material strength and improve the decay property (collapsing property) of the material. Thus, a compact and high-strength alumina sintered compact. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH09107043A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH09107043A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH09107043A3</originalsourceid><addsrcrecordid>eNrjZBB29An19fRzVHB2DXL09XRW8PF04WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgaWhgbmBibGjsbEqAEASEEeQA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ALUMINA CERAMIC LID</title><source>esp@cenet</source><creator>NOZAKI TOSHIO ; SHIGEMURA SHUJI ; MINO KATSUJI</creator><creatorcontrib>NOZAKI TOSHIO ; SHIGEMURA SHUJI ; MINO KATSUJI</creatorcontrib><description>PROBLEM TO BE SOLVED: To enhance the folding strength of an alumina ceramic lid which seals the cavity of a ceramic package. SOLUTION: An alumina ceramic lid 14 is bonded with solder 15 to the top face of a ceramic package 11 to seal its cavity 12. Primary grain of alumina, the raw material of the lid 14, is pulverized into a fine grain of 1-2 microns in a mean grain size and press-formed (after decay) to increase the contact points of the primary grain, thereby improving the sintering property. It is more treated to provide a sharp grain size distribution having D10-D90 (accumulated 10% and 90% grain sizes from the fine grain side) within ±70% of the mean grain size. Owing to this, the primary grain is roughly charged in the granular material before press-forming, thereby increasing the porosity to lower the granular material strength and improve the decay property (collapsing property) of the material. Thus, a compact and high-strength alumina sintered compact.</description><edition>6</edition><language>eng</language><subject>ARTIFICIAL STONE ; BASIC ELECTRIC ELEMENTS ; CEMENTS ; CERAMICS ; CHEMISTRY ; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS ; CONCRETE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LIME, MAGNESIA ; METALLURGY ; REFRACTORIES ; SEMICONDUCTOR DEVICES ; SLAG ; TREATMENT OF NATURAL STONE</subject><creationdate>1997</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970422&DB=EPODOC&CC=JP&NR=H09107043A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19970422&DB=EPODOC&CC=JP&NR=H09107043A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NOZAKI TOSHIO</creatorcontrib><creatorcontrib>SHIGEMURA SHUJI</creatorcontrib><creatorcontrib>MINO KATSUJI</creatorcontrib><title>ALUMINA CERAMIC LID</title><description>PROBLEM TO BE SOLVED: To enhance the folding strength of an alumina ceramic lid which seals the cavity of a ceramic package. SOLUTION: An alumina ceramic lid 14 is bonded with solder 15 to the top face of a ceramic package 11 to seal its cavity 12. Primary grain of alumina, the raw material of the lid 14, is pulverized into a fine grain of 1-2 microns in a mean grain size and press-formed (after decay) to increase the contact points of the primary grain, thereby improving the sintering property. It is more treated to provide a sharp grain size distribution having D10-D90 (accumulated 10% and 90% grain sizes from the fine grain side) within ±70% of the mean grain size. Owing to this, the primary grain is roughly charged in the granular material before press-forming, thereby increasing the porosity to lower the granular material strength and improve the decay property (collapsing property) of the material. Thus, a compact and high-strength alumina sintered compact.</description><subject>ARTIFICIAL STONE</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CEMENTS</subject><subject>CERAMICS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</subject><subject>CONCRETE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LIME, MAGNESIA</subject><subject>METALLURGY</subject><subject>REFRACTORIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SLAG</subject><subject>TREATMENT OF NATURAL STONE</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1997</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB29An19fRzVHB2DXL09XRW8PF04WFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgaWhgbmBibGjsbEqAEASEEeQA</recordid><startdate>19970422</startdate><enddate>19970422</enddate><creator>NOZAKI TOSHIO</creator><creator>SHIGEMURA SHUJI</creator><creator>MINO KATSUJI</creator><scope>EVB</scope></search><sort><creationdate>19970422</creationdate><title>ALUMINA CERAMIC LID</title><author>NOZAKI TOSHIO ; SHIGEMURA SHUJI ; MINO KATSUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH09107043A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1997</creationdate><topic>ARTIFICIAL STONE</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CEMENTS</topic><topic>CERAMICS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</topic><topic>CONCRETE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LIME, MAGNESIA</topic><topic>METALLURGY</topic><topic>REFRACTORIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SLAG</topic><topic>TREATMENT OF NATURAL STONE</topic><toplevel>online_resources</toplevel><creatorcontrib>NOZAKI TOSHIO</creatorcontrib><creatorcontrib>SHIGEMURA SHUJI</creatorcontrib><creatorcontrib>MINO KATSUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NOZAKI TOSHIO</au><au>SHIGEMURA SHUJI</au><au>MINO KATSUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ALUMINA CERAMIC LID</title><date>1997-04-22</date><risdate>1997</risdate><abstract>PROBLEM TO BE SOLVED: To enhance the folding strength of an alumina ceramic lid which seals the cavity of a ceramic package. SOLUTION: An alumina ceramic lid 14 is bonded with solder 15 to the top face of a ceramic package 11 to seal its cavity 12. Primary grain of alumina, the raw material of the lid 14, is pulverized into a fine grain of 1-2 microns in a mean grain size and press-formed (after decay) to increase the contact points of the primary grain, thereby improving the sintering property. It is more treated to provide a sharp grain size distribution having D10-D90 (accumulated 10% and 90% grain sizes from the fine grain side) within ±70% of the mean grain size. Owing to this, the primary grain is roughly charged in the granular material before press-forming, thereby increasing the porosity to lower the granular material strength and improve the decay property (collapsing property) of the material. Thus, a compact and high-strength alumina sintered compact.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPH09107043A |
| source | esp@cenet |
| subjects | ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA METALLURGY REFRACTORIES SEMICONDUCTOR DEVICES SLAG TREATMENT OF NATURAL STONE |
| title | ALUMINA CERAMIC LID |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-27T23%3A14%3A31IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NOZAKI%20TOSHIO&rft.date=1997-04-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH09107043A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |