PHOTOSENSITIVE COMPOSITION
PURPOSE: To ensure high sensitivity for a photosensitive compsn., to suppress the generation of gaseous HCl, etc., to confine chlorine radicals generated from a triazine polymn. initiator in the reaction system and to suppress the occurrence of a mask deposit by adding epoxy resin to the photosensit...
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| creator | IWAKURA SHUJI TANI MIZUHITO KUBOTA NAOHIRO IRINO MARIKO |
| description | PURPOSE: To ensure high sensitivity for a photosensitive compsn., to suppress the generation of gaseous HCl, etc., to confine chlorine radicals generated from a triazine polymn. initiator in the reaction system and to suppress the occurrence of a mask deposit by adding epoxy resin to the photosensitive compsn. CONSTITUTION: An epoxy resin is added to a photosensitive compsn. consisting of a coloring material, dispersant added acrylic resin, a photopolymerizable monomer, a triazine polymn. initiator and a solvent. The polymn. initiator is made of a mixture contg. at least one kind of triazine compd. and at least one kind of aminoacetophenone compd. The epoxy resin is added by an amt. (pts.wt.) 1/2 to 2 times the amt. of the polymn. initiator. The epoxy resin is, e.g. alicyclic epoxy resin, polyalcohol type epoxy resin, polyglycol type epoxy resin, bisphenol type epoxy resin or novolak type epoxy resin. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH0895238A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH0895238A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH0895238A3</originalsourceid><addsrcrecordid>eNrjZJAK8PAP8Q929Qv2DPEMc1Vw9vcN8Aex_f14GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8V4CHgYWlqZGxhaMxEUoALUEgnw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PHOTOSENSITIVE COMPOSITION</title><source>esp@cenet</source><creator>IWAKURA SHUJI ; TANI MIZUHITO ; KUBOTA NAOHIRO ; IRINO MARIKO</creator><creatorcontrib>IWAKURA SHUJI ; TANI MIZUHITO ; KUBOTA NAOHIRO ; IRINO MARIKO</creatorcontrib><description>PURPOSE: To ensure high sensitivity for a photosensitive compsn., to suppress the generation of gaseous HCl, etc., to confine chlorine radicals generated from a triazine polymn. initiator in the reaction system and to suppress the occurrence of a mask deposit by adding epoxy resin to the photosensitive compsn. CONSTITUTION: An epoxy resin is added to a photosensitive compsn. consisting of a coloring material, dispersant added acrylic resin, a photopolymerizable monomer, a triazine polymn. initiator and a solvent. The polymn. initiator is made of a mixture contg. at least one kind of triazine compd. and at least one kind of aminoacetophenone compd. The epoxy resin is added by an amt. (pts.wt.) 1/2 to 2 times the amt. of the polymn. initiator. The epoxy resin is, e.g. alicyclic epoxy resin, polyalcohol type epoxy resin, polyglycol type epoxy resin, bisphenol type epoxy resin or novolak type epoxy resin.</description><edition>6</edition><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>1996</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960412&DB=EPODOC&CC=JP&NR=H0895238A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960412&DB=EPODOC&CC=JP&NR=H0895238A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IWAKURA SHUJI</creatorcontrib><creatorcontrib>TANI MIZUHITO</creatorcontrib><creatorcontrib>KUBOTA NAOHIRO</creatorcontrib><creatorcontrib>IRINO MARIKO</creatorcontrib><title>PHOTOSENSITIVE COMPOSITION</title><description>PURPOSE: To ensure high sensitivity for a photosensitive compsn., to suppress the generation of gaseous HCl, etc., to confine chlorine radicals generated from a triazine polymn. initiator in the reaction system and to suppress the occurrence of a mask deposit by adding epoxy resin to the photosensitive compsn. CONSTITUTION: An epoxy resin is added to a photosensitive compsn. consisting of a coloring material, dispersant added acrylic resin, a photopolymerizable monomer, a triazine polymn. initiator and a solvent. The polymn. initiator is made of a mixture contg. at least one kind of triazine compd. and at least one kind of aminoacetophenone compd. The epoxy resin is added by an amt. (pts.wt.) 1/2 to 2 times the amt. of the polymn. initiator. The epoxy resin is, e.g. alicyclic epoxy resin, polyalcohol type epoxy resin, polyglycol type epoxy resin, bisphenol type epoxy resin or novolak type epoxy resin.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1996</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAK8PAP8Q929Qv2DPEMc1Vw9vcN8Aex_f14GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8V4CHgYWlqZGxhaMxEUoALUEgnw</recordid><startdate>19960412</startdate><enddate>19960412</enddate><creator>IWAKURA SHUJI</creator><creator>TANI MIZUHITO</creator><creator>KUBOTA NAOHIRO</creator><creator>IRINO MARIKO</creator><scope>EVB</scope></search><sort><creationdate>19960412</creationdate><title>PHOTOSENSITIVE COMPOSITION</title><author>IWAKURA SHUJI ; TANI MIZUHITO ; KUBOTA NAOHIRO ; IRINO MARIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0895238A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1996</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>IWAKURA SHUJI</creatorcontrib><creatorcontrib>TANI MIZUHITO</creatorcontrib><creatorcontrib>KUBOTA NAOHIRO</creatorcontrib><creatorcontrib>IRINO MARIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IWAKURA SHUJI</au><au>TANI MIZUHITO</au><au>KUBOTA NAOHIRO</au><au>IRINO MARIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE COMPOSITION</title><date>1996-04-12</date><risdate>1996</risdate><abstract>PURPOSE: To ensure high sensitivity for a photosensitive compsn., to suppress the generation of gaseous HCl, etc., to confine chlorine radicals generated from a triazine polymn. initiator in the reaction system and to suppress the occurrence of a mask deposit by adding epoxy resin to the photosensitive compsn. CONSTITUTION: An epoxy resin is added to a photosensitive compsn. consisting of a coloring material, dispersant added acrylic resin, a photopolymerizable monomer, a triazine polymn. initiator and a solvent. The polymn. initiator is made of a mixture contg. at least one kind of triazine compd. and at least one kind of aminoacetophenone compd. The epoxy resin is added by an amt. (pts.wt.) 1/2 to 2 times the amt. of the polymn. initiator. The epoxy resin is, e.g. alicyclic epoxy resin, polyalcohol type epoxy resin, polyglycol type epoxy resin, bisphenol type epoxy resin or novolak type epoxy resin.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
| title | PHOTOSENSITIVE COMPOSITION |
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