LEAD FRAME, SEMICONDUCTOR DEVICE, AND MANUFACTURE OF SEMICONDUCTOR DEVICE
PURPOSE: To improve the reflow crack resistivity of an LSI package, and to provide the technique with which a lead frame can be standardized. CONSTITUTION: The die-pad provided on the conventional lead frame is disused, retaining leads 3, which are rectilinearly extended to the center of mounting po...
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| creator | MATSUZAWA ASAO KAJIWARA YUJIRO SUZUKI KAZUNARI ONO HIROSHI TSUBOSAKI KUNIHIRO NISHIDA TAKAFUMI |
| description | PURPOSE: To improve the reflow crack resistivity of an LSI package, and to provide the technique with which a lead frame can be standardized. CONSTITUTION: The die-pad provided on the conventional lead frame is disused, retaining leads 3, which are rectilinearly extended to the center of mounting position of a semiconductor pellet 1, are provided, a thermoplastic resin adhesion layer is formed in advance on the upper surface of the retaining leads, and a semiconductor pellet 1 is fixed to the retaining leads 3 through the above- mentioned adhesion layer. Accordingly, by the disuse of the die-pad and by the fixing of the semiconductor pellet using the retaining leads, the adhesion area of the backside of the semiconductor pellet and sealing resin can be increased, and the resistivity of reflow crack can be improved. By the formation of the adhesion layer in conformity with the largest semiconductor pellet, the lead frame can be suitable for the semiconductor pellets of various sizes, and this contributes to the standardization of lead frames. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH0864746A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH0864746A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH0864746A3</originalsourceid><addsrcrecordid>eNrjZPD0cXV0UXALcvR11VEIdvX1dPb3cwl1DvEPUnBxDfN0Boo6-rko-Dr6hbo5OoeEBrkq-LthVcjDwJqWmFOcyguluRkU3FxDnD10Uwvy41OLCxKTU_NSS-K9AjwMLMxMzE3MHI2JUAIAsycssA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>LEAD FRAME, SEMICONDUCTOR DEVICE, AND MANUFACTURE OF SEMICONDUCTOR DEVICE</title><source>esp@cenet</source><creator>MATSUZAWA ASAO ; KAJIWARA YUJIRO ; SUZUKI KAZUNARI ; ONO HIROSHI ; TSUBOSAKI KUNIHIRO ; NISHIDA TAKAFUMI</creator><creatorcontrib>MATSUZAWA ASAO ; KAJIWARA YUJIRO ; SUZUKI KAZUNARI ; ONO HIROSHI ; TSUBOSAKI KUNIHIRO ; NISHIDA TAKAFUMI</creatorcontrib><description>PURPOSE: To improve the reflow crack resistivity of an LSI package, and to provide the technique with which a lead frame can be standardized. CONSTITUTION: The die-pad provided on the conventional lead frame is disused, retaining leads 3, which are rectilinearly extended to the center of mounting position of a semiconductor pellet 1, are provided, a thermoplastic resin adhesion layer is formed in advance on the upper surface of the retaining leads, and a semiconductor pellet 1 is fixed to the retaining leads 3 through the above- mentioned adhesion layer. Accordingly, by the disuse of the die-pad and by the fixing of the semiconductor pellet using the retaining leads, the adhesion area of the backside of the semiconductor pellet and sealing resin can be increased, and the resistivity of reflow crack can be improved. By the formation of the adhesion layer in conformity with the largest semiconductor pellet, the lead frame can be suitable for the semiconductor pellets of various sizes, and this contributes to the standardization of lead frames.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>1996</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960308&DB=EPODOC&CC=JP&NR=H0864746A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960308&DB=EPODOC&CC=JP&NR=H0864746A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MATSUZAWA ASAO</creatorcontrib><creatorcontrib>KAJIWARA YUJIRO</creatorcontrib><creatorcontrib>SUZUKI KAZUNARI</creatorcontrib><creatorcontrib>ONO HIROSHI</creatorcontrib><creatorcontrib>TSUBOSAKI KUNIHIRO</creatorcontrib><creatorcontrib>NISHIDA TAKAFUMI</creatorcontrib><title>LEAD FRAME, SEMICONDUCTOR DEVICE, AND MANUFACTURE OF SEMICONDUCTOR DEVICE</title><description>PURPOSE: To improve the reflow crack resistivity of an LSI package, and to provide the technique with which a lead frame can be standardized. CONSTITUTION: The die-pad provided on the conventional lead frame is disused, retaining leads 3, which are rectilinearly extended to the center of mounting position of a semiconductor pellet 1, are provided, a thermoplastic resin adhesion layer is formed in advance on the upper surface of the retaining leads, and a semiconductor pellet 1 is fixed to the retaining leads 3 through the above- mentioned adhesion layer. Accordingly, by the disuse of the die-pad and by the fixing of the semiconductor pellet using the retaining leads, the adhesion area of the backside of the semiconductor pellet and sealing resin can be increased, and the resistivity of reflow crack can be improved. By the formation of the adhesion layer in conformity with the largest semiconductor pellet, the lead frame can be suitable for the semiconductor pellets of various sizes, and this contributes to the standardization of lead frames.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1996</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPD0cXV0UXALcvR11VEIdvX1dPb3cwl1DvEPUnBxDfN0Boo6-rko-Dr6hbo5OoeEBrkq-LthVcjDwJqWmFOcyguluRkU3FxDnD10Uwvy41OLCxKTU_NSS-K9AjwMLMxMzE3MHI2JUAIAsycssA</recordid><startdate>19960308</startdate><enddate>19960308</enddate><creator>MATSUZAWA ASAO</creator><creator>KAJIWARA YUJIRO</creator><creator>SUZUKI KAZUNARI</creator><creator>ONO HIROSHI</creator><creator>TSUBOSAKI KUNIHIRO</creator><creator>NISHIDA TAKAFUMI</creator><scope>EVB</scope></search><sort><creationdate>19960308</creationdate><title>LEAD FRAME, SEMICONDUCTOR DEVICE, AND MANUFACTURE OF SEMICONDUCTOR DEVICE</title><author>MATSUZAWA ASAO ; KAJIWARA YUJIRO ; SUZUKI KAZUNARI ; ONO HIROSHI ; TSUBOSAKI KUNIHIRO ; NISHIDA TAKAFUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0864746A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1996</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>MATSUZAWA ASAO</creatorcontrib><creatorcontrib>KAJIWARA YUJIRO</creatorcontrib><creatorcontrib>SUZUKI KAZUNARI</creatorcontrib><creatorcontrib>ONO HIROSHI</creatorcontrib><creatorcontrib>TSUBOSAKI KUNIHIRO</creatorcontrib><creatorcontrib>NISHIDA TAKAFUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MATSUZAWA ASAO</au><au>KAJIWARA YUJIRO</au><au>SUZUKI KAZUNARI</au><au>ONO HIROSHI</au><au>TSUBOSAKI KUNIHIRO</au><au>NISHIDA TAKAFUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LEAD FRAME, SEMICONDUCTOR DEVICE, AND MANUFACTURE OF SEMICONDUCTOR DEVICE</title><date>1996-03-08</date><risdate>1996</risdate><abstract>PURPOSE: To improve the reflow crack resistivity of an LSI package, and to provide the technique with which a lead frame can be standardized. CONSTITUTION: The die-pad provided on the conventional lead frame is disused, retaining leads 3, which are rectilinearly extended to the center of mounting position of a semiconductor pellet 1, are provided, a thermoplastic resin adhesion layer is formed in advance on the upper surface of the retaining leads, and a semiconductor pellet 1 is fixed to the retaining leads 3 through the above- mentioned adhesion layer. Accordingly, by the disuse of the die-pad and by the fixing of the semiconductor pellet using the retaining leads, the adhesion area of the backside of the semiconductor pellet and sealing resin can be increased, and the resistivity of reflow crack can be improved. By the formation of the adhesion layer in conformity with the largest semiconductor pellet, the lead frame can be suitable for the semiconductor pellets of various sizes, and this contributes to the standardization of lead frames.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | LEAD FRAME, SEMICONDUCTOR DEVICE, AND MANUFACTURE OF SEMICONDUCTOR DEVICE |
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