METHOD OF MANUFACTURING CIRCUIT BOARD

PURPOSE:To easily form a high-precision and high-reliability circuit pattern even on a circuit-forming board having through-holes of small diameters. CONSTITUTION:An insulating board 1 has conductive layers 2 on both sides and through-holes 3 piercing the conductive layers 2 and board 1. A conductiv...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SHIMAMOTO TOSHIJI, YOKOCHI AKIRA
Format: Patent
Sprache:eng
Schlagworte:
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