METHOD OF MANUFACTURING CIRCUIT BOARD

METHOD OF MANUFACTURING CIRCUIT BOARD

PURPOSE:To easily form a high-precision and high-reliability circuit pattern even on a circuit-forming board having through-holes of small diameters. CONSTITUTION:An insulating board 1 has conductive layers 2 on both sides and through-holes 3 piercing the conductive layers 2 and board 1. A conductiv...

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Hauptverfasser: SHIMAMOTO TOSHIJI, YOKOCHI AKIRA
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator SHIMAMOTO TOSHIJI
YOKOCHI AKIRA
description PURPOSE:To easily form a high-precision and high-reliability circuit pattern even on a circuit-forming board having through-holes of small diameters. CONSTITUTION:An insulating board 1 has conductive layers 2 on both sides and through-holes 3 piercing the conductive layers 2 and board 1. A conductive layer 5 for electrically connecting the conductive layers existing on both sides of the insulating board is formed on the inner wall of each through-hole 3. An insulating substance 4 is charged in the through-holes such that the end faces thereof are flush with the conductive layers existing on the surface of the insulating board whereby a circuit-forming board is formed. A photoresist film 6 is formed on the surface of this circuit-forming board by the electrodeposition method. Then, the exposure and development of this film are performed to form a resist pattern 7 for etching.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title METHOD OF MANUFACTURING CIRCUIT BOARD
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