PRODUCTION OF METAL HONEYCOMB MEMBER

PURPOSE: To supply an accurate and proper amt. of a solder material by forming a honeycomb structure from a strip material whose surface region becoming a non-soldering region is subjected to water repelling treatment and immersing the honeycomb structure in an aq. dispersion of a solder material po...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TSUKIIDE YUUZOU, SERIZAWA HARUO
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY ENGINE PLANTS IN GENERAL GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR INTERNALCOMBUSTION ENGINES GAS-FLOW SILENCERS OR EXHAUST APPARATUS FOR MACHINES ORENGINES IN GENERAL HEATING LIGHTING MACHINES OR ENGINES IN GENERAL MECHANICAL ENGINEERING PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL STEAM ENGINES THEIR RELEVANT APPARATUS TRANSPORTING WEAPONS
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Beschreibung
Zusammenfassung:	PURPOSE: To supply an accurate and proper amt. of a solder material by forming a honeycomb structure from a strip material whose surface region becoming a non-soldering region is subjected to water repelling treatment and immersing the honeycomb structure in an aq. dispersion of a solder material powder and heating the obtained honeycomb structure to bond the solder bonding region thereof by a solder material. CONSTITUTION: When producing a metal honeycomb member composed of a flat strip material 1 and a corrugated strip material 2 both of which are made of a thin-walled metal plate, water repelling treatment is applied to the flat strip material 1. The water repelling treatment region 1b is set to the central part of the flat strip material in the length direction thereof and a water repelling non-treatment region 1a is set to both side parts of the flat strip material 1 in the length direction thereof and, as a water repelling treatment means, a coating means of a substance having water repelling capacity, for example, mineral oil or asphalt is used. The obtained honeycomb structure is immersed in an aq. dispersion of a solder material powder to form a solder material coating layer on a solder bonding region other than a solder non- bonding region and heated to bond the solder bonding region.