PRODUCTION OF MULTILAYER LAMINATED BOARD

PURPOSE: To obtain a method for producing a multilayer laminated board without generating any void when a plurality of multilayer boards are shaped in a hot plate. CONSTITUTION: When a plurality of multilayer laminates, each comprising a prepreg 2 superposed on an inner layer circuit board 1 and an outer layer material 3 arranged in the outermost layer, are stacked through shaping plates 5, the inner layer circuit board 1 is provided with a conductor circuit 6 covering one half or more of the surface of an insulating board 7 which is exposed 8 asymmetrically through the conductor circuit 6. Adjacent inner circuit boards 1a, 1b of the multilayer laminate sandwiching the shaping plate 5 are stacked while reversing the lateral orientation. With such method, pressure being applied to the prepreg 2 located on the upper surface of the insulating board at the exposed part 8 is distributed alternately even if it is weak as compared with the surroundings thus preventing the pressure from being shifted extremely.