MANUFACTURE OF THROUGH HOLE FILLED UP WITH CONDUCTOR
PURPOSE: To firmly stick a conductor to a ceramic substrate by filling up the through hole of the ceramic substrate with conductor paste having a low shrink characteristic after a glass layer is formed on the internal surface of the through hole by printing and baking glass paste and baking the cond...
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| creator | MORI MAMORU MIYAKOSHI MOTOHARU MIZUSHIMA KIYOSHI |
| description | PURPOSE: To firmly stick a conductor to a ceramic substrate by filling up the through hole of the ceramic substrate with conductor paste having a low shrink characteristic after a glass layer is formed on the internal surface of the through hole by printing and baking glass paste and baking the conductor paste. CONSTITUTION: A glass layer or conductor layer 3 containing a glass component is formed on the internal surface 2a of the through hole 1 of a ceramic substrate 1 by printing and baking paste to improve the adhesion of the internal surface 2a of the hole 2 and a conductor filling up the hole 2. Then a filled-up through hole is obtained by filling the hole 2 with the glass layer or conductor layer 3 containing the glass component on its internal surface 2a with conductor paste 4 having a low shrink property and baking the paste 4. The conductor used for filling up the hole 2 is prepared by mixing >=0.1wt.% ruthenium oxide powder or rhodium powder in conductive powder composed mainly of silver or copper powder. When the paste 4 is used, the reliability of the connection between the wiring on the surface of the substrate 1 and through hole conductor can be improved. |
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CONSTITUTION: A glass layer or conductor layer 3 containing a glass component is formed on the internal surface 2a of the through hole 1 of a ceramic substrate 1 by printing and baking paste to improve the adhesion of the internal surface 2a of the hole 2 and a conductor filling up the hole 2. Then a filled-up through hole is obtained by filling the hole 2 with the glass layer or conductor layer 3 containing the glass component on its internal surface 2a with conductor paste 4 having a low shrink property and baking the paste 4. The conductor used for filling up the hole 2 is prepared by mixing >=0.1wt.% ruthenium oxide powder or rhodium powder in conductive powder composed mainly of silver or copper powder. When the paste 4 is used, the reliability of the connection between the wiring on the surface of the substrate 1 and through hole conductor can be improved.</description><edition>6</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>1996</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960830&DB=EPODOC&CC=JP&NR=H08222852A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960830&DB=EPODOC&CC=JP&NR=H08222852A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MORI MAMORU</creatorcontrib><creatorcontrib>MIYAKOSHI MOTOHARU</creatorcontrib><creatorcontrib>MIZUSHIMA KIYOSHI</creatorcontrib><title>MANUFACTURE OF THROUGH HOLE FILLED UP WITH CONDUCTOR</title><description>PURPOSE: To firmly stick a conductor to a ceramic substrate by filling up the through hole of the ceramic substrate with conductor paste having a low shrink characteristic after a glass layer is formed on the internal surface of the through hole by printing and baking glass paste and baking the conductor paste. CONSTITUTION: A glass layer or conductor layer 3 containing a glass component is formed on the internal surface 2a of the through hole 1 of a ceramic substrate 1 by printing and baking paste to improve the adhesion of the internal surface 2a of the hole 2 and a conductor filling up the hole 2. Then a filled-up through hole is obtained by filling the hole 2 with the glass layer or conductor layer 3 containing the glass component on its internal surface 2a with conductor paste 4 having a low shrink property and baking the paste 4. The conductor used for filling up the hole 2 is prepared by mixing >=0.1wt.% ruthenium oxide powder or rhodium powder in conductive powder composed mainly of silver or copper powder. When the paste 4 is used, the reliability of the connection between the wiring on the surface of the substrate 1 and through hole conductor can be improved.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1996</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDxdfQLdXN0DgkNclXwd1MI8QjyD3X3UPDw93FVcPP08XF1UQgNUAj3DPFQcPb3cwl1DvEP4mFgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgYWRkZGFqZGjsbEqAEAyasnkg</recordid><startdate>19960830</startdate><enddate>19960830</enddate><creator>MORI MAMORU</creator><creator>MIYAKOSHI MOTOHARU</creator><creator>MIZUSHIMA KIYOSHI</creator><scope>EVB</scope></search><sort><creationdate>19960830</creationdate><title>MANUFACTURE OF THROUGH HOLE FILLED UP WITH CONDUCTOR</title><author>MORI MAMORU ; MIYAKOSHI MOTOHARU ; MIZUSHIMA KIYOSHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH08222852A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1996</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MORI MAMORU</creatorcontrib><creatorcontrib>MIYAKOSHI MOTOHARU</creatorcontrib><creatorcontrib>MIZUSHIMA KIYOSHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MORI MAMORU</au><au>MIYAKOSHI MOTOHARU</au><au>MIZUSHIMA KIYOSHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURE OF THROUGH HOLE FILLED UP WITH CONDUCTOR</title><date>1996-08-30</date><risdate>1996</risdate><abstract>PURPOSE: To firmly stick a conductor to a ceramic substrate by filling up the through hole of the ceramic substrate with conductor paste having a low shrink characteristic after a glass layer is formed on the internal surface of the through hole by printing and baking glass paste and baking the conductor paste. CONSTITUTION: A glass layer or conductor layer 3 containing a glass component is formed on the internal surface 2a of the through hole 1 of a ceramic substrate 1 by printing and baking paste to improve the adhesion of the internal surface 2a of the hole 2 and a conductor filling up the hole 2. Then a filled-up through hole is obtained by filling the hole 2 with the glass layer or conductor layer 3 containing the glass component on its internal surface 2a with conductor paste 4 having a low shrink property and baking the paste 4. The conductor used for filling up the hole 2 is prepared by mixing >=0.1wt.% ruthenium oxide powder or rhodium powder in conductive powder composed mainly of silver or copper powder. When the paste 4 is used, the reliability of the connection between the wiring on the surface of the substrate 1 and through hole conductor can be improved.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | MANUFACTURE OF THROUGH HOLE FILLED UP WITH CONDUCTOR |
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