MANUFACTURE OF SELF-ALIGNED OPTICAL FIBER-OPTICAL ELEMENT COUPLING DEVICE

PROBLEM TO BE SOLVED: To provide a manufacturing method for a self-arranging type optical fiber- optical element coupler by which the occurrence of an arranging error in a V groove and a solder bump can be prevented and the optical coupling efficiency of an optical element and optical fiber can be i...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KIN KOUBAN, KIN TOUKIYUU, SHIYU HIROKANE, RI JIYOUKAN
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator KIN KOUBAN
KIN TOUKIYUU
SHIYU HIROKANE
RI JIYOUKAN
description PROBLEM TO BE SOLVED: To provide a manufacturing method for a self-arranging type optical fiber- optical element coupler by which the occurrence of an arranging error in a V groove and a solder bump can be prevented and the optical coupling efficiency of an optical element and optical fiber can be improved. SOLUTION: This manufacturing method is provided with a process of forming a first insulating film 13 and a pair of metallic pads 15 on a surface of a silicon substrate 11, a process of forming a second insulating film 17 on the first insulating film 13 and the metallic pads 15, a process of forming a photosensitive film 19 so that second opening parts 23 are formed in parts corresponding to the respective metallic pads 15 and a first opening part 21 is formed in an intermediate position of the two second opening parts 23, a process of exposing the silicon substrate 11 and the metallic pads 15 by removing the first and the second insulating films 13 and 17 by using the photosensitive film 19 as a mask, a process of forming a V groove 27 in an exposed part of the silicon substrate 11 by using the first and the second insulating films 13 and 17 as a corrosively carving mask after the photosensitive film 19 is removed and a process of forming a solder bump on the metallic pads 15.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH08220385A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH08220385A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH08220385A3</originalsourceid><addsrcrecordid>eNrjZPD0dfQLdXN0DgkNclXwd1MIdvVx03X08XT3c3VR8A8I8XR29FFw83RyDdKF8Vx9XH1d_UIUnP1DA3w8_dwVXFzDPJ1deRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvFeAh4GFkZGBsYWpozExagAlmC0t</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MANUFACTURE OF SELF-ALIGNED OPTICAL FIBER-OPTICAL ELEMENT COUPLING DEVICE</title><source>esp@cenet</source><creator>KIN KOUBAN ; KIN TOUKIYUU ; SHIYU HIROKANE ; RI JIYOUKAN</creator><creatorcontrib>KIN KOUBAN ; KIN TOUKIYUU ; SHIYU HIROKANE ; RI JIYOUKAN</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a manufacturing method for a self-arranging type optical fiber- optical element coupler by which the occurrence of an arranging error in a V groove and a solder bump can be prevented and the optical coupling efficiency of an optical element and optical fiber can be improved. SOLUTION: This manufacturing method is provided with a process of forming a first insulating film 13 and a pair of metallic pads 15 on a surface of a silicon substrate 11, a process of forming a second insulating film 17 on the first insulating film 13 and the metallic pads 15, a process of forming a photosensitive film 19 so that second opening parts 23 are formed in parts corresponding to the respective metallic pads 15 and a first opening part 21 is formed in an intermediate position of the two second opening parts 23, a process of exposing the silicon substrate 11 and the metallic pads 15 by removing the first and the second insulating films 13 and 17 by using the photosensitive film 19 as a mask, a process of forming a V groove 27 in an exposed part of the silicon substrate 11 by using the first and the second insulating films 13 and 17 as a corrosively carving mask after the photosensitive film 19 is removed and a process of forming a solder bump on the metallic pads 15.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DEVICES USING STIMULATED EMISSION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS ; SEMICONDUCTOR DEVICES</subject><creationdate>1996</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19960830&amp;DB=EPODOC&amp;CC=JP&amp;NR=H08220385A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19960830&amp;DB=EPODOC&amp;CC=JP&amp;NR=H08220385A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIN KOUBAN</creatorcontrib><creatorcontrib>KIN TOUKIYUU</creatorcontrib><creatorcontrib>SHIYU HIROKANE</creatorcontrib><creatorcontrib>RI JIYOUKAN</creatorcontrib><title>MANUFACTURE OF SELF-ALIGNED OPTICAL FIBER-OPTICAL ELEMENT COUPLING DEVICE</title><description>PROBLEM TO BE SOLVED: To provide a manufacturing method for a self-arranging type optical fiber- optical element coupler by which the occurrence of an arranging error in a V groove and a solder bump can be prevented and the optical coupling efficiency of an optical element and optical fiber can be improved. SOLUTION: This manufacturing method is provided with a process of forming a first insulating film 13 and a pair of metallic pads 15 on a surface of a silicon substrate 11, a process of forming a second insulating film 17 on the first insulating film 13 and the metallic pads 15, a process of forming a photosensitive film 19 so that second opening parts 23 are formed in parts corresponding to the respective metallic pads 15 and a first opening part 21 is formed in an intermediate position of the two second opening parts 23, a process of exposing the silicon substrate 11 and the metallic pads 15 by removing the first and the second insulating films 13 and 17 by using the photosensitive film 19 as a mask, a process of forming a V groove 27 in an exposed part of the silicon substrate 11 by using the first and the second insulating films 13 and 17 as a corrosively carving mask after the photosensitive film 19 is removed and a process of forming a solder bump on the metallic pads 15.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DEVICES USING STIMULATED EMISSION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1996</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPD0dfQLdXN0DgkNclXwd1MIdvVx03X08XT3c3VR8A8I8XR29FFw83RyDdKF8Vx9XH1d_UIUnP1DA3w8_dwVXFzDPJ1deRhY0xJzilN5oTQ3g6Kba4izh25qQX58anFBYnJqXmpJvFeAh4GFkZGBsYWpozExagAlmC0t</recordid><startdate>19960830</startdate><enddate>19960830</enddate><creator>KIN KOUBAN</creator><creator>KIN TOUKIYUU</creator><creator>SHIYU HIROKANE</creator><creator>RI JIYOUKAN</creator><scope>EVB</scope></search><sort><creationdate>19960830</creationdate><title>MANUFACTURE OF SELF-ALIGNED OPTICAL FIBER-OPTICAL ELEMENT COUPLING DEVICE</title><author>KIN KOUBAN ; KIN TOUKIYUU ; SHIYU HIROKANE ; RI JIYOUKAN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH08220385A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1996</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DEVICES USING STIMULATED EMISSION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KIN KOUBAN</creatorcontrib><creatorcontrib>KIN TOUKIYUU</creatorcontrib><creatorcontrib>SHIYU HIROKANE</creatorcontrib><creatorcontrib>RI JIYOUKAN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIN KOUBAN</au><au>KIN TOUKIYUU</au><au>SHIYU HIROKANE</au><au>RI JIYOUKAN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANUFACTURE OF SELF-ALIGNED OPTICAL FIBER-OPTICAL ELEMENT COUPLING DEVICE</title><date>1996-08-30</date><risdate>1996</risdate><abstract>PROBLEM TO BE SOLVED: To provide a manufacturing method for a self-arranging type optical fiber- optical element coupler by which the occurrence of an arranging error in a V groove and a solder bump can be prevented and the optical coupling efficiency of an optical element and optical fiber can be improved. SOLUTION: This manufacturing method is provided with a process of forming a first insulating film 13 and a pair of metallic pads 15 on a surface of a silicon substrate 11, a process of forming a second insulating film 17 on the first insulating film 13 and the metallic pads 15, a process of forming a photosensitive film 19 so that second opening parts 23 are formed in parts corresponding to the respective metallic pads 15 and a first opening part 21 is formed in an intermediate position of the two second opening parts 23, a process of exposing the silicon substrate 11 and the metallic pads 15 by removing the first and the second insulating films 13 and 17 by using the photosensitive film 19 as a mask, a process of forming a V groove 27 in an exposed part of the silicon substrate 11 by using the first and the second insulating films 13 and 17 as a corrosively carving mask after the photosensitive film 19 is removed and a process of forming a solder bump on the metallic pads 15.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JPH08220385A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
SEMICONDUCTOR DEVICES
title MANUFACTURE OF SELF-ALIGNED OPTICAL FIBER-OPTICAL ELEMENT COUPLING DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-06T06%3A53%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIN%20KOUBAN&rft.date=1996-08-30&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH08220385A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true