WAFER HOUSING METHOD IN SLICING MACHINE AND DEVICE THEREOF
PURPOSE: To simplify the structure of a device and consequently contrive to reduce failure rate. CONSTITUTION: A wafer (w) cut with an annular cutting edge is suckingly supported by a suction pad 3 so as to transport the wafer (w) under horizontal state rearward in order to transport the wafer in a...
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| creator | KUSHIDA RYOZO |
| description | PURPOSE: To simplify the structure of a device and consequently contrive to reduce failure rate. CONSTITUTION: A wafer (w) cut with an annular cutting edge is suckingly supported by a suction pad 3 so as to transport the wafer (w) under horizontal state rearward in order to transport the wafer in a wafer housing cassette 11. After that, the sucking action of the suction pad 3 is released. After that, by raising the cassette 11 one step by one step successively, the supplied wafer (w) is placed on a housing shelf of the cassette 11. Accordingly, since the wafer is supplied directly to the cassette by being transported rearward as is sucked by the suction pad, the constitution of the device is simple. Further, by utilizing an one-pitch cylinder for raising the cassette, the raising of one pitch of the cassette is exact and durable. |
| format | Patent |
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CONSTITUTION: A wafer (w) cut with an annular cutting edge is suckingly supported by a suction pad 3 so as to transport the wafer (w) under horizontal state rearward in order to transport the wafer in a wafer housing cassette 11. After that, the sucking action of the suction pad 3 is released. After that, by raising the cassette 11 one step by one step successively, the supplied wafer (w) is placed on a housing shelf of the cassette 11. Accordingly, since the wafer is supplied directly to the cassette by being transported rearward as is sucked by the suction pad, the constitution of the device is simple. Further, by utilizing an one-pitch cylinder for raising the cassette, the raising of one pitch of the cassette is exact and durable.</description><edition>6</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WORKING CEMENT, CLAY, OR STONE ; WORKING STONE OR STONE-LIKE MATERIALS</subject><creationdate>1996</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960806&DB=EPODOC&CC=JP&NR=H08197535A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960806&DB=EPODOC&CC=JP&NR=H08197535A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUSHIDA RYOZO</creatorcontrib><title>WAFER HOUSING METHOD IN SLICING MACHINE AND DEVICE THEREOF</title><description>PURPOSE: To simplify the structure of a device and consequently contrive to reduce failure rate. 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Further, by utilizing an one-pitch cylinder for raising the cassette, the raising of one pitch of the cassette is exact and durable.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><subject>WORKING CEMENT, CLAY, OR STONE</subject><subject>WORKING STONE OR STONE-LIKE MATERIALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1996</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAKd3RzDVLw8A8N9vRzV_B1DfHwd1Hw9FMI9vF0Bos4Ont4-rkqOPq5KLi4hnk6uyqEeLgGufq78TCwpiXmFKfyQmluBkU31xBnD93Ugvz41OKCxOTUvNSSeK8ADwMLQ0tzU2NTR2Ni1AAAkBAo5w</recordid><startdate>19960806</startdate><enddate>19960806</enddate><creator>KUSHIDA RYOZO</creator><scope>EVB</scope></search><sort><creationdate>19960806</creationdate><title>WAFER HOUSING METHOD IN SLICING MACHINE AND DEVICE THEREOF</title><author>KUSHIDA RYOZO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH08197535A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1996</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><topic>WORKING CEMENT, CLAY, OR STONE</topic><topic>WORKING STONE OR STONE-LIKE MATERIALS</topic><toplevel>online_resources</toplevel><creatorcontrib>KUSHIDA RYOZO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUSHIDA RYOZO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WAFER HOUSING METHOD IN SLICING MACHINE AND DEVICE THEREOF</title><date>1996-08-06</date><risdate>1996</risdate><abstract>PURPOSE: To simplify the structure of a device and consequently contrive to reduce failure rate. CONSTITUTION: A wafer (w) cut with an annular cutting edge is suckingly supported by a suction pad 3 so as to transport the wafer (w) under horizontal state rearward in order to transport the wafer in a wafer housing cassette 11. After that, the sucking action of the suction pad 3 is released. After that, by raising the cassette 11 one step by one step successively, the supplied wafer (w) is placed on a housing shelf of the cassette 11. Accordingly, since the wafer is supplied directly to the cassette by being transported rearward as is sucked by the suction pad, the constitution of the device is simple. Further, by utilizing an one-pitch cylinder for raising the cassette, the raising of one pitch of the cassette is exact and durable.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS |
| title | WAFER HOUSING METHOD IN SLICING MACHINE AND DEVICE THEREOF |
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