PAD FOR GRINDING
PURPOSE: To provide a durable pad for grinding by embossing recessed grooves formed on the surface of a grinding layer and thereby reducing dust produced from the ends of the grooves. CONSTITUTION: A pad for grinding comprises porous forming resin for grinding layer 15 containing the material to be...
Gespeichert in:
| Hauptverfasser: | , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | TAKANO JUNZO SUZUKI KEIKO |
| description | PURPOSE: To provide a durable pad for grinding by embossing recessed grooves formed on the surface of a grinding layer and thereby reducing dust produced from the ends of the grooves. CONSTITUTION: A pad for grinding comprises porous forming resin for grinding layer 15 containing the material to be ground and has a desired pattern on the surface of the grinding layer by embossing the recessed grooves 18 with hot press, etc. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH08197434A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH08197434A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH08197434A3</originalsourceid><addsrcrecordid>eNrjZBAIcHRRcPMPUnAP8vRz8fRz52FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgYWhpbmJsYmjsbEqAEA9Ksdjw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PAD FOR GRINDING</title><source>esp@cenet</source><creator>TAKANO JUNZO ; SUZUKI KEIKO</creator><creatorcontrib>TAKANO JUNZO ; SUZUKI KEIKO</creatorcontrib><description>PURPOSE: To provide a durable pad for grinding by embossing recessed grooves formed on the surface of a grinding layer and thereby reducing dust produced from the ends of the grooves. CONSTITUTION: A pad for grinding comprises porous forming resin for grinding layer 15 containing the material to be ground and has a desired pattern on the surface of the grinding layer by embossing the recessed grooves 18 with hot press, etc.</description><edition>6</edition><language>eng</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TOOLS FOR GRINDING, BUFFING, OR SHARPENING ; TRANSPORTING</subject><creationdate>1996</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960806&DB=EPODOC&CC=JP&NR=H08197434A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19960806&DB=EPODOC&CC=JP&NR=H08197434A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKANO JUNZO</creatorcontrib><creatorcontrib>SUZUKI KEIKO</creatorcontrib><title>PAD FOR GRINDING</title><description>PURPOSE: To provide a durable pad for grinding by embossing recessed grooves formed on the surface of a grinding layer and thereby reducing dust produced from the ends of the grooves. CONSTITUTION: A pad for grinding comprises porous forming resin for grinding layer 15 containing the material to be ground and has a desired pattern on the surface of the grinding layer by embossing the recessed grooves 18 with hot press, etc.</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1996</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBAIcHRRcPMPUnAP8vRz8fRz52FgTUvMKU7lhdLcDIpuriHOHrqpBfnxqcUFicmpeakl8V4BHgYWhpbmJsYmjsbEqAEA9Ksdjw</recordid><startdate>19960806</startdate><enddate>19960806</enddate><creator>TAKANO JUNZO</creator><creator>SUZUKI KEIKO</creator><scope>EVB</scope></search><sort><creationdate>19960806</creationdate><title>PAD FOR GRINDING</title><author>TAKANO JUNZO ; SUZUKI KEIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH08197434A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1996</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TOOLS FOR GRINDING, BUFFING, OR SHARPENING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKANO JUNZO</creatorcontrib><creatorcontrib>SUZUKI KEIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKANO JUNZO</au><au>SUZUKI KEIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PAD FOR GRINDING</title><date>1996-08-06</date><risdate>1996</risdate><abstract>PURPOSE: To provide a durable pad for grinding by embossing recessed grooves formed on the surface of a grinding layer and thereby reducing dust produced from the ends of the grooves. CONSTITUTION: A pad for grinding comprises porous forming resin for grinding layer 15 containing the material to be ground and has a desired pattern on the surface of the grinding layer by embossing the recessed grooves 18 with hot press, etc.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_JPH08197434A |
| source | esp@cenet |
| subjects | DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING |
| title | PAD FOR GRINDING |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-06T19%3A24%3A18IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAKANO%20JUNZO&rft.date=1996-08-06&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH08197434A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |