OPTICAL FIBER PACKAGING METHOD OF OPTICAL TRANSMISSION MODULE

PURPOSE:To facilitate assembly by subjecting the surplus length-components of optical fibers to styling to assure the permissible bending radii of the optical fibers within an external case of an transparent transmission module. CONSTITUTION:A light emitting element module 4 and a light receiving el...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TAKAYAMA KAZUTOSHI, HAMAGUCHI TSURUYOSHI, HIMI SUSUMU, IWATO TAISUKE, HANAI KUNIE
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator TAKAYAMA KAZUTOSHI
HAMAGUCHI TSURUYOSHI
HIMI SUSUMU
IWATO TAISUKE
HANAI KUNIE
description PURPOSE:To facilitate assembly by subjecting the surplus length-components of optical fibers to styling to assure the permissible bending radii of the optical fibers within an external case of an transparent transmission module. CONSTITUTION:A light emitting element module 4 and a light receiving element module 5 are soldered and fixed to a circuit board 3 by an attachment of accessories. The terminals of the respective element modules are soldered and connected to the through-hole part of the circuit board 3. A WDM coupler 6 is held by a coupler holder 7 made of a sheet metal. In such a case, the surplus length-components of the optical fibers 11 need be packaged (styling operation) on the rear surface side of the circuit board 3 and, therefore, mounting of the circuit board 3 at an upper case is executed by taking workability into consideration. The styling operation of the optical fibers 11 is carried out after mounting of the circuit board 3 and the optical fibers are bundled by electrical insulating sheets 10 having excellent heat resistance. The bundling is executed by inserting the optical fibers 11 into the heat resistant electrical insulating sheets 10 molded to a V shape and sticking the sheets to each other by tapes.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JPH0815573A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JPH0815573A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JPH0815573A3</originalsourceid><addsrcrecordid>eNrjZLD1DwjxdHb0UXDzdHINUghwdPZ2dPf0c1fwdQ3x8HdR8HdTgKkICXL0C_b1DA729PdT8PV3CfVx5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8V4BHgYWhqam5saOxkQoAQDciCmp</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>OPTICAL FIBER PACKAGING METHOD OF OPTICAL TRANSMISSION MODULE</title><source>esp@cenet</source><creator>TAKAYAMA KAZUTOSHI ; HAMAGUCHI TSURUYOSHI ; HIMI SUSUMU ; IWATO TAISUKE ; HANAI KUNIE</creator><creatorcontrib>TAKAYAMA KAZUTOSHI ; HAMAGUCHI TSURUYOSHI ; HIMI SUSUMU ; IWATO TAISUKE ; HANAI KUNIE</creatorcontrib><description>PURPOSE:To facilitate assembly by subjecting the surplus length-components of optical fibers to styling to assure the permissible bending radii of the optical fibers within an external case of an transparent transmission module. CONSTITUTION:A light emitting element module 4 and a light receiving element module 5 are soldered and fixed to a circuit board 3 by an attachment of accessories. The terminals of the respective element modules are soldered and connected to the through-hole part of the circuit board 3. A WDM coupler 6 is held by a coupler holder 7 made of a sheet metal. In such a case, the surplus length-components of the optical fibers 11 need be packaged (styling operation) on the rear surface side of the circuit board 3 and, therefore, mounting of the circuit board 3 at an upper case is executed by taking workability into consideration. The styling operation of the optical fibers 11 is carried out after mounting of the circuit board 3 and the optical fibers are bundled by electrical insulating sheets 10 having excellent heat resistance. The bundling is executed by inserting the optical fibers 11 into the heat resistant electrical insulating sheets 10 molded to a V shape and sticking the sheets to each other by tapes.</description><edition>6</edition><language>eng</language><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS</subject><creationdate>1996</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19960119&amp;DB=EPODOC&amp;CC=JP&amp;NR=H0815573A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=19960119&amp;DB=EPODOC&amp;CC=JP&amp;NR=H0815573A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKAYAMA KAZUTOSHI</creatorcontrib><creatorcontrib>HAMAGUCHI TSURUYOSHI</creatorcontrib><creatorcontrib>HIMI SUSUMU</creatorcontrib><creatorcontrib>IWATO TAISUKE</creatorcontrib><creatorcontrib>HANAI KUNIE</creatorcontrib><title>OPTICAL FIBER PACKAGING METHOD OF OPTICAL TRANSMISSION MODULE</title><description>PURPOSE:To facilitate assembly by subjecting the surplus length-components of optical fibers to styling to assure the permissible bending radii of the optical fibers within an external case of an transparent transmission module. CONSTITUTION:A light emitting element module 4 and a light receiving element module 5 are soldered and fixed to a circuit board 3 by an attachment of accessories. The terminals of the respective element modules are soldered and connected to the through-hole part of the circuit board 3. A WDM coupler 6 is held by a coupler holder 7 made of a sheet metal. In such a case, the surplus length-components of the optical fibers 11 need be packaged (styling operation) on the rear surface side of the circuit board 3 and, therefore, mounting of the circuit board 3 at an upper case is executed by taking workability into consideration. The styling operation of the optical fibers 11 is carried out after mounting of the circuit board 3 and the optical fibers are bundled by electrical insulating sheets 10 having excellent heat resistance. The bundling is executed by inserting the optical fibers 11 into the heat resistant electrical insulating sheets 10 molded to a V shape and sticking the sheets to each other by tapes.</description><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1996</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD1DwjxdHb0UXDzdHINUghwdPZ2dPf0c1fwdQ3x8HdR8HdTgKkICXL0C_b1DA729PdT8PV3CfVx5WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8V4BHgYWhqam5saOxkQoAQDciCmp</recordid><startdate>19960119</startdate><enddate>19960119</enddate><creator>TAKAYAMA KAZUTOSHI</creator><creator>HAMAGUCHI TSURUYOSHI</creator><creator>HIMI SUSUMU</creator><creator>IWATO TAISUKE</creator><creator>HANAI KUNIE</creator><scope>EVB</scope></search><sort><creationdate>19960119</creationdate><title>OPTICAL FIBER PACKAGING METHOD OF OPTICAL TRANSMISSION MODULE</title><author>TAKAYAMA KAZUTOSHI ; HAMAGUCHI TSURUYOSHI ; HIMI SUSUMU ; IWATO TAISUKE ; HANAI KUNIE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JPH0815573A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1996</creationdate><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKAYAMA KAZUTOSHI</creatorcontrib><creatorcontrib>HAMAGUCHI TSURUYOSHI</creatorcontrib><creatorcontrib>HIMI SUSUMU</creatorcontrib><creatorcontrib>IWATO TAISUKE</creatorcontrib><creatorcontrib>HANAI KUNIE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKAYAMA KAZUTOSHI</au><au>HAMAGUCHI TSURUYOSHI</au><au>HIMI SUSUMU</au><au>IWATO TAISUKE</au><au>HANAI KUNIE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>OPTICAL FIBER PACKAGING METHOD OF OPTICAL TRANSMISSION MODULE</title><date>1996-01-19</date><risdate>1996</risdate><abstract>PURPOSE:To facilitate assembly by subjecting the surplus length-components of optical fibers to styling to assure the permissible bending radii of the optical fibers within an external case of an transparent transmission module. CONSTITUTION:A light emitting element module 4 and a light receiving element module 5 are soldered and fixed to a circuit board 3 by an attachment of accessories. The terminals of the respective element modules are soldered and connected to the through-hole part of the circuit board 3. A WDM coupler 6 is held by a coupler holder 7 made of a sheet metal. In such a case, the surplus length-components of the optical fibers 11 need be packaged (styling operation) on the rear surface side of the circuit board 3 and, therefore, mounting of the circuit board 3 at an upper case is executed by taking workability into consideration. The styling operation of the optical fibers 11 is carried out after mounting of the circuit board 3 and the optical fibers are bundled by electrical insulating sheets 10 having excellent heat resistance. The bundling is executed by inserting the optical fibers 11 into the heat resistant electrical insulating sheets 10 molded to a V shape and sticking the sheets to each other by tapes.</abstract><edition>6</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JPH0815573A
source esp@cenet
subjects OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
title OPTICAL FIBER PACKAGING METHOD OF OPTICAL TRANSMISSION MODULE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T22%3A43%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAKAYAMA%20KAZUTOSHI&rft.date=1996-01-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJPH0815573A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true