MANUFACTURE OF CERAMIC PRINTED WIRING BOARD

PURPOSE: To prevent the occurrence of a skip phenomenon which occurs at the time of performing electroless plating by heat-treating a ceramic printed wiring board after a thick resistor layer, terminal layer, and insulator layer are formed on the board and before an electroless-plated layer is forme...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KANETANI DAISUKE, FUKUYA NAOHITO, MORIOKA KAZUNOBU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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